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Springer Low Dielectric Constant Materials for IC Applications - Springer

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Description

Low dielectric constant materials are essential components in modern microelectronic device design and manufacturing. This comprehensive technical reference from Springer covers the latest low-k materials technology, thin film characterisation methods, and integration strategies for back-end interconnects and packaging applications in microelectronics. Drawing on contributions from leading academic and industrial laboratories, this book delivers in-depth information about materials technologies for sub-0.18 micrometre process nodes. Coverage includes organic dielectric materials, inorganic dielectric materials, and composite dielectrics, making it an indispensable resource for engineers, materials scientists, and researchers working on advanced semiconductor fabrication and microelectronic device development.

Key Features

Springer's advanced microelectronics series volume provides comprehensive coverage of low-k materials technology for modern integrated circuit applications.

Detailed exploration of organic dielectric materials, inorganic dielectric materials, and composite dielect systems for microelectronic interconnects.

Materials characterisation and integration information specific to sub-0.18 micrometre process technology and back-end interconnect solutions.

Contributions from leading academic and industrial laboratories offering practical, research-backed guidance for semiconductor manufacturers and materials engineers.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
14 November 2002
Listed Since
22 December 2006

Barcode

No barcode data available

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