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Springer Low Dielectric Constant Materials for IC Applications

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Description

Low dielectric constant materials serve as a vital component in the development of modern microelectronic devices. This comprehensive volume from the Springer Series in Advanced Microelectronics provides an in-depth look at the latest low-k materials technology. It covers essential aspects of thin film materials characterization, integration, and reliability specifically for back-end interconnects and packaging applications. Drawing on highly informative contributions from leading academic and industrial laboratories, this book offers a technical deep dive into materials technologies for <0.18 um process technology. It serves as a valuable resource for engineers and researchers studying organic dielectric materials, inorganic dielectric materials, and composite dielectrics. Whether you are focusing on semiconductor manufacturing or advanced microelectronics packaging, this text provides the necessary technical foundation to understand current material trends and integration challenges.

Key Features

Covers the latest low-dielectric-constant (low-k) materials technology for modern microelectronic device development.

Provides technical details on thin film materials characterization and integration for back-end interconnects.

Includes expert contributions from leading industrial and academic laboratories for a well-rounded perspective.

Offers specific information regarding materials technologies for <0.18 um process technology.

Explores various material types including organic dielectric materials, inorganic dielectric materials, and composite dielectrics.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
14 November 2002
Listed Since
22 December 2006

Barcode

No barcode data available

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