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£145.74
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£146 today · previous high £146 · all-time low £137
Brand: ASM International ISTFA 2021 Conference Proceedings - System-in-Package Technology
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Price distribution over 70 days • 3 price levels
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Most common price: £137 (48 days, 68.6%)
Price range: £137 - £146
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Description
Key Features
ISTFA 2021 proceedings document cutting-edge research on System-in-Package (SiP) technology presented at the 47th International Symposium for Testing and Failure Analysis.
Papers cover board and system level failure analysis techniques essential for identifying defects and improving electronic component reliability.
Includes detailed discussions on detecting counterfeit microelectronics and preventing fraud in the electronic supply chain.
Features research on hardware attacks, security vulnerabilities, and reverse engineering methods for protecting advanced electronic systems.
Comprehensive coverage of scanning probe analysis, microscopy and material characterization for detailed component inspection.
Explores nanoprobing and electrical characterisation techniques that enable precise testing of complex integrated circuits and assemblies.
Product Specifications
- Brand
- Brand: ASM International
- Format
- paperback
- ASIN
- 1627084193
- Domain
- Amazon UK
- Release Date
- 30 July 2022
- Listed Since
- 07 March 2022
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