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£117.61
Brand: ASM International ASM International ISTFA 2021 - Conference Proceedings
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Description
Key Features
Covers System-in-Package (SiP) technology as the primary theme for the 2021 conference proceedings.
Includes detailed research on board and system level failure analysis for complex electronic assemblies.
Provides methods for detecting counterfeit microelectronics to ensure hardware integrity and security.
Explores advanced microscopy, material characterization, and nanoprobing for electrical characterization.
Addresses modern security concerns including hardware attacks and reverse engineering techniques.
Discusses emerging failure analysis concepts and future challenges facing the industry today.
Product Specifications
- Brand
- Brand: ASM International
- Format
- paperback
- ASIN
- 1627084193
- Domain
- Amazon UK
- Release Date
- 30 July 2022
- Listed Since
- 07 March 2022
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