£77.75

Springer High-Frequency Characterization of Electronic Packaging: 1 (Electronic Packaging and Interconnects, 1)

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£77.75 £74.03 £74.84 £75.65 £76.47 £77.28 £78.09 25 January 2026 14 February 2026 06 March 2026 26 March 2026 15 April 2026

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Description

High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.

Product Specifications

Format
paperback
Domain
Amazon UK
Publication Date
23 February 2014
Listed Since
06 August 2014

Barcode

No barcode data available

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