RF and Microwave Microelectronics Packaging II: 2 - Image 1

£54.80

Springer RF and Microwave Microelectronics Packaging II: 2

Name: RF and Microwave Microelectronics Packaging II: 2
Brand: Springer
Price: 52.0 GBP
Availability: InStock

Circuits

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Description

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Product Specifications

Brand: Springer
Format: hardcover
ASIN: 3319516965
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Electronics & Communications Engineering > Electronics Engineering > Circuits
Domain: Amazon UK
Release Date: 22 March 2017
Listed Since: 24 November 2016

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Springer RF and Microwave Microelectronics Packaging II: 2

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