£92.16

Springer RF and Microwave Microelectronics Packaging II: 2

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£92.19 £82.62 £84.71 £86.80 £88.88 £90.97 £93.06 25 April 2026 15 May 2026 04 June 2026 24 June 2026 14 July 2026

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20 days 7 days 2 days 13 days 2 days 2 days 35 days · current 0 9 18 26 35 £83 £85 £86 £87 £88 £91 £92 Days at Price

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Most common price: £92 (35 days, 43.2%)

Price range: £83 - £92

Price levels: 7 different prices over 81 days

Description

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

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