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£91.14
Springer RF and Microwave Microelectronics Packaging II: 2
Price data last checked 12 day(s) ago - will refresh soon
Price History & Forecast
Last 44 days • 44 data points (No recent data available)
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Price distribution over 44 days • 5 price levels
Current Price
Price Analysis
Most common price: £88 (14 days, 31.8%)
Price range: £87 - £92
Price levels: 5 different prices over 44 days
Description
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Product Specifications
- Brand
- Springer
- Format
- paperback
- ASIN
- 3319847198
- Domain
- Amazon UK
- Release Date
- 09 June 2018
- Listed Since
- 11 June 2018
Barcode
No barcode data available
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