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£107.98
Springer RF and Microwave Microelectronics Packaging Book
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Description
Key Features
Covers latest developments in thermal management for high-frequency electronics.
Provides insights into electrical, RF, and thermal-mechanical designs and simulations.
Explains modern packaging and processing methods used in the industry.
Supports academic research by addressing leading issues in the commercial sector.
Serves as a technical guide for practicing engineers in electronic packaging fields.
Product Specifications
- Brand
- Springer
- Format
- paperback
- ASIN
- 1489983244
- Domain
- Amazon UK
- Publication Date
- 05 September 2014
- Listed Since
- 24 September 2014
Barcode
No barcode data available
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