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Springer Advanced Materials for Thermal Management Book

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Description

As thermal challenges become barriers to electronic industry performance, the need for advanced thermal management materials in electronic packaging is widely recognized. This Springer publication addresses the requirements for smaller, more capable, and more efficient electronic power devices. From active electronically scanned radar arrays to web servers, modern systems require components that dissipate heat efficiently. This book explores the necessity for materials that possess a high capability of dissipating heat while maintaining compatibility within complex electronic systems.

Key Features

This Springer publication addresses thermal management materials for electronic packaging.

The text covers requirements for smaller and more efficient electronic power devices.

Content includes applications for systems ranging from radar arrays to web servers.

The book focuses on materials with a high capability of dissipating heat efficiently.

Part of the Springer Series in Advanced Microelectronics, volume 30.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
10 January 2011
Listed Since
24 September 2010

Barcode

No barcode data available

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