£74.11

About as cheap as it gets — within 5% of the all-time low it hit 1 month ago.

£74 today · all-time low £73 (Sep 2026) · usually £74

Springer Silicon Microchannel Heat Sinks: Theories and Phenomena (Microtechnology and MEMS)

View at Amazon

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 62 days · 62 data points (no recent data)

Historical
Generating forecast…
£75.06 £72.68 £73.20 £73.72 £74.24 £74.76 £75.28 25 July 2026 09 August 2026 24 August 2026 08 September 2026 24 September 2026
View at Amazon ↗

Price data last checked 29 day(s) ago - will refresh soon

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↑ Price chart
when this has been cheap or pricey
↑ Forecast
where the price is heading next
↓ Statistics
all-time high & low, recent range
↑ Price alert
name your number, we'll email you

Price Distribution

Price distribution over 62 days • 3 price levels

Days at Price
Current Price
14 days 34 days · current 14 days 0 9 17 26 34 £73 £74 £75 Days at Price

Price Analysis

Most common price: £74 (34 days, 54.8%)

Price range: £73 - £75

Price levels: 3 different prices over 62 days

Description

There is significant current interest in new technologies for IC (Integrated Circuit) cooling, driven by the rapid increase in power densities in ICs and the trend towards high-density electronic packaging for applications throughout civilian and military markets. In accordance with Moore's Law, the number of transistors on 6 Intel Pentium microprocessors has increased from 7.5 x10 in 1997 (Pentium II) to 6 55 x10 in 2002 (Pentium 4). Considering the rapid increase in the integration density, thermal management must be well designed to ensure proper functionality of these high-speed, high-power chips. Forced air convection has been traditionally used to remove the heat through a finned heat sink and fan module. 2 Currently, with 82 W power dissipation rate, approximately 62 W/cm heat flux, from a Pentium 4 processor with 3.06 GHz core frequency, the noise generated from high rotating speed fans is approaching the limit of acceptable level for humans. However, the power dissipation from a single cost-performance chip is 2 expected to exceed 100 W/cm by the year 2005, when the air cooling has to be replaced by new cooling technologies. Among alternative cooling methods, the two-phase microchannel heat sink is one of the most promising solutions. Understanding the boiling process and the two-phase flow behavior in microchannels is the key to successful implementation of such a device.

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
10 April 2011
Listed Since
01 October 2010

Barcode

No barcode data available

Similar Products You Might Like

Microchannel Phase Change Transport Phenomena
97% match

Microchannel Phase Change Transport Phenomena

Elsevier

£70.40 23 Sep 2026
Thermal Management of Microelectronic Equipment (Electronic Packaging): Heat Transfer Theory, Analysis Methods, and Design Practices
96% match

Thermal Management of Microelectronic Equipment (Electronic Packaging): Heat Transfer Theory, Analysis Methods, and Design Practices

ASME Press

£174.50 19 Sep 2026
Adaptive Cooling of Integrated Circuits Using Digital Microfluidics
96% match

Adaptive Cooling of Integrated Circuits Using Digital Microfluidics

Artech House

£51.06 24 Sep 2026
Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling
95% match

Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling

CRC Press

£110.00 30 Sep 2026
Thermal Design of Electronic Equipment (Electronics Handbook Series)
95% match

Thermal Design of Electronic Equipment (Electronics Handbook Series)

CRC Press

£173.57 02 Oct 2026
Thermal and Electro-thermal System Simulation 2020
95% match

Thermal and Electro-thermal System Simulation 2020

£54.50 30 Sep 2026
Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
95% match

Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration

Springer

£69.13 19 Sep 2026
Advanced Thermal Design of Electronic Equipment
95% match

Advanced Thermal Design of Electronic Equipment

Springer

£148.21 02 Oct 2026
Thermal Management Materials for Electronic Packaging - Wiley
95% match

Thermal Management Materials for Electronic Packaging - Wiley

Wiley

£108.35 02 Oct 2026
Managing Temperature Effects in Nanoscale Adaptive Systems
95% match

Managing Temperature Effects in Nanoscale Adaptive Systems

Springer

£75.68 24 Sep 2026
Integrated Interconnect Technologies for 3D Nanoelectronic Systems
95% match

Integrated Interconnect Technologies for 3D Nanoelectronic Systems

Artech House

£160.99 24 Sep 2026
Academic Press Nanofluid Boiling - Heat Transfer Research
95% match

Academic Press Nanofluid Boiling - Heat Transfer Research

Elsevier

£117.69 02 Oct 2026
Contemporary Perspectives on Flow Boiling Instabilities in Microchannels and Minichannels (Contemporary Perspectives in Emerging Technologies)
95% match

Contemporary Perspectives on Flow Boiling Instabilities in Microchannels and Minichannels (Contemporary Perspectives in Emerging Technologies)

£166.00 25 Sep 2026
Heat Transfer at Low Temperatures (The International Cryogenics Monograph Series)
95% match

Heat Transfer at Low Temperatures (The International Cryogenics Monograph Series)

Springer

£140.20 26 Sep 2026