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Annual Review of Heat Transfer Volume 18 - Thermal Management

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Description

Annual Review of Heat Transfer: Volume 18 provides a comprehensive look at thermal management fundamentals and technologies. This volume summarizes significant progress in addressing cooling challenges for electronics, covering everything from the device junction to the full system level. It is designed for professionals working in defense, commercial, and space systems where advanced thermal management is required. The content includes technical examinations of GaN composite substrates for high power, wide band gap power amplifiers. It also explores opportunities found in nanostructured thermal interface materials. This collection serves as a vital resource for understanding recent advancements in heat transfer technology.

Key Features

Covers thermal management technologies for defense, commercial, and space systems.

Addresses electronics cooling challenges from the device junction to the system level.

Examines GaN composite substrates for near junction thermal management of high power amplifiers.

Discusses technical opportunities in nanostructured thermal interface materials.

Published by Begell House Publishers Inc. for professional reference.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
30 July 2016
Listed Since
11 July 2016

Barcode

No barcode data available

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