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Springer - Thermal Stress and Strain in Microelectronics

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Description

As microelectronics packaging and interconnection evolve, the focus has shifted from individual silicon components to entire systems. To achieve high density, performance, yield, and reliability in lightweight, low-cost systems, engineers require a precise understanding of system behavior. This Springer publication addresses the complex mechanical and thermal phenomena encountered in microelectronics packaging systems. Because these factors are found on the critical path of nearly every design and process, this book provides necessary insights into the thermal stress and strain that impact the quality and reliability of modern electronic systems.

Key Features

This Springer publication covers thermal stress and strain within microelectronics packaging systems.

The text addresses mechanical and thermal phenomena that impact design and process reliability.

It provides insights into achieving high density, performance, and yield in electronic systems.

The content focuses on the complex system behaviors required for lightweight and low-cost microelectronics.

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
30 April 2012
Listed Since
18 April 2014

Barcode

No barcode data available

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