We can't find the internet
Attempting to reconnect
Something went wrong!
Hang in there while we get back on track
£77.19
Artech House Wafer-Level Testing and Test During Burn-In for Integrated Circuits (Artech House Integrated Microsystems)
Price data checked 6 days ago
We'll watch every seller, every day. One email when your price arrives.
This is the most expensive it has ever been. Walk away.
£77 today · previous high £77 · all-time low £46
NEW HERE?
Amazon shows you one price. We show you all of them.
Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.
WHAT'S ON THIS PAGE
when this has been cheap or pricey
where the price is heading next
all-time high & low, recent range
name your number, we'll email you
Price History & Forecast
Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.
Last 85 days • 85 data points (No recent data available)
Price Distribution
Price distribution over 85 days • 2 price levels
Price Analysis
Most common price: £46 (72 days, 84.7%)
Price range: £46 - £77
Price levels: 2 different prices over 85 days
Description
Product Specifications
- Brand
- Artech House
- Format
- hardcover
- ASIN
- 1596939893
- Domain
- Amazon UK
- Release Date
- 31 March 2010
- Listed Since
- 12 October 2009
Barcode
No barcode data available
Similar Products You Might Like
Wafer Scale Integration
Springer
Practices of Wafer Fab Operations
CREATESPACE
Techniques and Challenges for 300mm Silicon: Processing, Characterization, Modelling and Equipment (European Materials Research Society Symposia Proceedings): Volume 81
Elsevier
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)
Wiley-IEEE Press
Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers
Wiley
SemiConductor Wafer Bonding: Science and Technology: 33 (The ECS Series of Texts and Monographs)
Wiley
Characterization in Silicon Processing (AGENCY/DISTRIBUTED)
Momentum Press
Testing of Interposer-Based 2.5D Integrated Circuits
Springer
Springer Wafer Bonding: Applications and Technology - Vol 75
Springer
Integrated Circuit Failure Analysis: A Guide to Preparation Techniques (Quality and Reliability Engineering Series)
Wiley
Crystal Growth and Evaluation of Silicon for VLSI and ULSI
CRC Press
The Science and Engineering of Microelectronic Fabrication (The Oxford Series in Electrical and Computer Engineering)
Oxford University Press
Production Planning and Control for Semiconductor Wafer Fabrication Facilities: Modeling, Analysis, and Systems: 52 (Operations Research/Computer Science Interfaces Series, 52)
Springer
Handbook of 3D Integration, Volume 3: 3D Process Technology
Wiley
Handbook of Semiconductor Manufacturing Technology
CRC Press
System-on-Chip Test Architectures: Nanometer Design for Testability: Volume . (Systems on Silicon, Volume .)
Morgan Kaufmann