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Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)
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Description
Printed collection of 90 full-length, peer-reviewed technical papers. Topics include:Autonomous, Hybrid, and Electric VehiclesEnergy Conversion and StorageFlexible and Wearable ElectronicsHeterogeneous IntegrationInternet of ThingsPhotonics and OpticsPower ElectronicsServers of the Future, Edge and Cloud Computing: Papers Honoring Michael Ellsworth for Contributions andService to ASME InterPACK, the Electronic and Photonic Packaging Division, and Leadership in Liquid Coolingof Server Systems
Product Specifications
- Format
- paperback
- ASIN
- 0791859320
- Domain
- Amazon UK
- Release Date
- 30 March 2020
- Listed Since
- 07 February 2020
Barcode
No barcode data available
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