Out of stock

This item is currently unavailable

Gone for 273 days. Could come back at any time — we're watching for you.

Out of stock 273 days · last price £435

Proceedings of the International Electronic Packaging Conference: Interpack 95 (EEP): Interpack 95 (EEP)

Amazon

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 668 days · 668 data points (no recent data)

Historical
Generating forecast…
£435.00 £413.25 £421.95 £430.65 £439.35 £448.05 £456.75 24 October 2024 08 April 2025 22 September 2025 08 March 2026 22 August 2026
View at Amazon ↗
Out of stock

Price data last checked 63 day(s) ago - refreshing...

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↑ Price chart
when this has been cheap or pricey
↑ Forecast
where the price is heading next
↓ Statistics
all-time high & low, recent range
↑ Price alert
name your number, we'll email you

Price Distribution

Price distribution over 668 days • 1 price levels

Days at Price
668 days 0 167 334 501 668 £435 Days at Price

Price Analysis

Most common price: £435 (668 days, 100.0%)

Price range: £435 - £435

Price levels: 1 different prices over 668 days

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
15 April 1995
Listed Since
02 February 2007

Barcode

No barcode data available

Similar Products You Might Like

Proceedings of the International Electronic Packaging Tech Conference and Exhibition-Volumes 1 & 2 (Set)
97% match

Proceedings of the International Electronic Packaging Tech Conference and Exhibition-Volumes 1 & 2 (Set)

Price unavailable
Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)
97% match

Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)

Price unavailable
Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference and Exhibition: Interpack 97 (EEP)
96% match

Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference and Exhibition: Interpack 97 (EEP)

Price unavailable
Proceedings of the 2007 Asme Interpack Conference: July 8-12-2007, Vancouver, Bc, Canada: 2
96% match

Proceedings of the 2007 Asme Interpack Conference: July 8-12-2007, Vancouver, Bc, Canada: 2

Price unavailable
The 2025-2030 World Outlook for Advanced Electronic Packaging
96% match

The 2025-2030 World Outlook for Advanced Electronic Packaging

Price unavailable
The 2013-2018 Outlook for Advanced Electronic Packaging in Europe
96% match

The 2013-2018 Outlook for Advanced Electronic Packaging in Europe

£325.00 23 Aug 2026
The 2013-2018 Outlook for Advanced Electronic Packaging in India
96% match

The 2013-2018 Outlook for Advanced Electronic Packaging in India

£495.00 22 Aug 2026
The 2013-2018 Outlook for Advanced Electronic Packaging in The Middle East
96% match

The 2013-2018 Outlook for Advanced Electronic Packaging in The Middle East

£325.00 20 Aug 2026
The 2023-2028 World Outlook for Advanced Electronic Packaging
96% match

The 2023-2028 World Outlook for Advanced Electronic Packaging

£795.00 13 Aug 2026
The 2016 Report on Advanced Electronic Packaging: World Market Segmentation by City
96% match

The 2016 Report on Advanced Electronic Packaging: World Market Segmentation by City

£995.00 24 Aug 2026
The 2016-2021 Outlook for Advanced Electronic Packaging in Japan
95% match

The 2016-2021 Outlook for Advanced Electronic Packaging in Japan

£595.00 04 Sep 2026
The 2025-2030 World Outlook for Digital Printing Packaging
95% match

The 2025-2030 World Outlook for Digital Printing Packaging

Price unavailable
Printed Electronics for Smart Packaging - Engineering Book
95% match

Printed Electronics for Smart Packaging - Engineering Book

Wiley

£110.89 02 Oct 2026
The 2023-2028 Outlook for Consumer Electronics Packaging in Japan
95% match

The 2023-2028 Outlook for Consumer Electronics Packaging in Japan

£495.00 22 Aug 2026
Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)
95% match

Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)

Price unavailable
The 2023-2028 Outlook for Consumer Electronics Packaging in China
95% match

The 2023-2028 Outlook for Consumer Electronics Packaging in China

£495.00 20 Aug 2026
The 2016 Report on General Packaging Equipment: World Market Segmentation by City
95% match

The 2016 Report on General Packaging Equipment: World Market Segmentation by City

£995.00 20 Aug 2026
The 2013-2018 Outlook for Advanced Electronic Packaging in Oceana
95% match

The 2013-2018 Outlook for Advanced Electronic Packaging in Oceana

£325.00 24 Aug 2026
The 2023-2028 World Outlook for 3D Package-on-Package Semiconductor Packaging
95% match

The 2023-2028 World Outlook for 3D Package-on-Package Semiconductor Packaging

Price unavailable
The 2016 Report on Packaging and Labeling Services: World Market Segmentation by City
95% match

The 2016 Report on Packaging and Labeling Services: World Market Segmentation by City

£995.00 14 Aug 2026
95% match

Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018)

Price unavailable
95% match

2002 Design Engineering Technical Conferences And Design For Manufacturing Conference: 3

Price unavailable
95% match

Proceedings of the Asme Interpack Conference--2009: Presented at 2009 Asme Interpack Conference: July 19-23, 2009, San Francisco, California, USA

Price unavailable
The 2016 Report on Packaging Machinery: World Market Segmentation by City
95% match

The 2016 Report on Packaging Machinery: World Market Segmentation by City

£995.00 16 Aug 2026