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Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018)

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Description

Printed collection of 62 full-length, peer-reviewed technical papers. Topics include:Heterogeneous Integration: Micro-Systems With Diverse FunctionalityServers of the Future, IoT, and Edge to CloudStructural and Physical Health MonitoringPower Electronics, Energy Conversion, and StorageAutonomous, Hybrid, and Electric Vehicles

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
30 October 2019
Listed Since
27 August 2019

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