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Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018)

Mechanics

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Printed collection of 62 full-length, peer-reviewed technical papers. Topics include:Heterogeneous Integration: Micro-Systems With Diverse FunctionalityServers of the Future, IoT, and Edge to CloudStructural and Physical Health MonitoringPower Electronics, Energy Conversion, and StorageAutonomous, Hybrid, and Electric Vehicles

Product Specifications

Format: paperback
ASIN: 0791851923
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Civil Engineering > Mechanics
Domain: Amazon UK
Release Date: 30 October 2019
Listed Since: 27 August 2019

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Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018)

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