2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 1

Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)

Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018)

ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Volume 1: Thermal Management

ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-Attach And Wafer Bonding Technology (A 4-Volume Set)

World Scientific Publishing Company

Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)

Proceedings of the Asme Interpack Conference--2009: Presented at 2009 Asme Interpack Conference: July 19-23, 2009, San Francisco, California

Laser-based Micro- and Nanopackaging and Assembly (Proceedings of SPIE)

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ASME 2014 International Mechanical Engineering Congress and Exposition: Volume 10: Micro-and Nano-Systems Engineering and Packaging

Proceedings of the Asme Interpack Conference--2009: Presented at 2009 Asme Interpack Conference: July 19-23, 2009, San Francisco, California, USA

Print Proceedings of the ASME 2016 International Mechanical Engineering Congress and Exposition (IMECE2016): Micro and Nano-Systems Engineering and Packaging Volume 10

Polymeric Materials for Microelectronics and Photonics Applications: Mechanics Physics Reliability Processing

Mechanical Analysis of Electronic Packaging Systems: 120 (Mechanical Engineering (Marcel Dekker Hardcover))

CRC Press

Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference and Exhibition: Interpack 97 (EEP)

Photonic Packaging Sourcebook: Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules

Springer

Proceedings of the 2007 Asme Interpack Conference: July 8-12-2007, Vancouver, Bc, Canada: 2

The 2013-2018 Outlook for Advanced Electronic Packaging in India

Laser-based Micro- and Nanopackaging and Assembly VI: 24-26 January 2012, San Francisco, California, United States

Laser-Based Micro- and Nanopackaging and Assembly: Volume V: 25-27 January 2011, San Francisco, California, United States

Proceedings of the ASME 2020 International Mechanical Engineering Congress and Exposition (IMECE2020) Volume 13: Micro- and Nano-Systems Engineering and Packaging

Principles of Photonic Integrated Circuits: Materials, Device Physics, Guided Wave Design (Graduate Texts in Physics)

Springer

Optical Components and Materials: Volume VIII: 25-26 January 2011, San Francisco, California, United States (Optical Components and Materials: 25-26 ... San Francisco, California, United States)