We can't find the internet
Attempting to reconnect
Something went wrong!
Hang in there while we get back on track
This item is currently unavailable
2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 1
Price data last checked 77 day(s) ago - refreshing...
One email. No newsletter. No nudges.
Gone for 164 days. Could come back at any time — we're watching for you.
Out of stock 164 days · last price £207 · longest previous gap was 1 days
NEW HERE?
Amazon shows you one price. We show you all of them.
Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.
WHAT'S ON THIS PAGE
when this has been cheap or pricey
where the price is heading next
all-time high & low, recent range
name your number, we'll email you
Price History & Forecast
Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.
Last 654 days • 654 data points (No recent data available)
Price Distribution
Price distribution over 654 days • 2 price levels
Price Analysis
Most common price: £207 (391 days, 59.8%)
Price range: £196 - £207
Price levels: 2 different prices over 654 days
Description
Product Specifications
- Format
- paperback
- ASIN
- 0791855759
- Domain
- Amazon UK
- Release Date
- 30 December 2013
- Listed Since
- 30 June 2015
Barcode
No barcode data available
Similar Products You Might Like
Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)
Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)
Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018)
ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Volume 1: Thermal Management
ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)
Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-Attach And Wafer Bonding Technology (A 4-Volume Set)
World Scientific Publishing Company
Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)
Proceedings of the Asme Interpack Conference--2009: Presented at 2009 Asme Interpack Conference: July 19-23, 2009, San Francisco, California
Laser-based Micro- and Nanopackaging and Assembly (Proceedings of SPIE)
Micro-optics, VCSELS, and Photonic Interconnects II: Fabrication, Packaging, and Integration (Proceedings of SPIE)
ASME 2014 International Mechanical Engineering Congress and Exposition: Volume 10: Micro-and Nano-Systems Engineering and Packaging
Proceedings of the Asme Interpack Conference--2009: Presented at 2009 Asme Interpack Conference: July 19-23, 2009, San Francisco, California, USA
Print Proceedings of the ASME 2016 International Mechanical Engineering Congress and Exposition (IMECE2016): Micro and Nano-Systems Engineering and Packaging Volume 10
Polymeric Materials for Microelectronics and Photonics Applications: Mechanics Physics Reliability Processing
Mechanical Analysis of Electronic Packaging Systems: 120 (Mechanical Engineering (Marcel Dekker Hardcover))
CRC Press
Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference and Exhibition: Interpack 97 (EEP)
Photonic Packaging Sourcebook: Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Springer
Proceedings of the 2007 Asme Interpack Conference: July 8-12-2007, Vancouver, Bc, Canada: 2
The 2013-2018 Outlook for Advanced Electronic Packaging in India
Laser-based Micro- and Nanopackaging and Assembly VI: 24-26 January 2012, San Francisco, California, United States
Laser-Based Micro- and Nanopackaging and Assembly: Volume V: 25-27 January 2011, San Francisco, California, United States
Proceedings of the ASME 2020 International Mechanical Engineering Congress and Exposition (IMECE2020) Volume 13: Micro- and Nano-Systems Engineering and Packaging
Principles of Photonic Integrated Circuits: Materials, Device Physics, Guided Wave Design (Graduate Texts in Physics)
Springer
