Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)

ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018)

2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 1

Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

Proceedings of the Asme Interpack Conference--2009: Presented at 2009 Asme Interpack Conference: July 19-23, 2009, San Francisco, California

Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)

Proceedings of the Asme Interpack Conference--2009: Presented at 2009 Asme Interpack Conference: July 19-23, 2009, San Francisco, California, USA

ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Volume 1: Thermal Management

Mechanical Analysis of Electronic Packaging Systems: 120 (Mechanical Engineering (Marcel Dekker Hardcover))

CRC Press

Proceedings of the 2007 Asme Interpack Conference: July 8-12-2007, Vancouver, Bc, Canada: 2

Electronic Packaging and Interconnection Handbook

McGraw-Hill Education

Print Proceedings of the ASME 2016 International Mechanical Engineering Congress and Exposition (IMECE2016): Micro and Nano-Systems Engineering and Packaging Volume 10

Polymeric Materials for Microelectronics and Photonics Applications: Mechanics Physics Reliability Processing

Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference and Exhibition: Interpack 97 (EEP)

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-Attach And Wafer Bonding Technology (A 4-Volume Set)

World Scientific Publishing Company

Proceedings of the International Electronic Packaging Conference: Interpack 95 (EEP): Interpack 95 (EEP)

Materials for Advanced Packaging

Springer

Packaging Innovations Interpack 2014: Volume 1

Sanex Packaging Connections Pvt Ltd

Proceedings of the ASME 2020 International Mechanical Engineering Congress and Exposition (IMECE2020) Volume 13: Micro- and Nano-Systems Engineering and Packaging

New English File: Upper-Intermediate: iPack (multiple computer/network): Digital resources for interactive teaching: Upper-intermediate level (New ... Digital Resources for Interactive Teaching)

Oxford University Press

ASME 2014 International Mechanical Engineering Congress and Exposition: Volume 10: Micro-and Nano-Systems Engineering and Packaging

Packaging Innovations Interpack 2014: Volume 2

Sanex Packaging Connections Pvt Ltd

Electronic Equipment Packaging Technology

Springer

ASME 2020 15th International Manufacturing Science and Engineering Conference (MSEC2020) Volume 1B: Additive Manufacturing; Advanced Materials ... Manufacturing Equipment and Automation