Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials) - Image 1

£184.29

Woodhead Publishing Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials)

Name: Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials)
Brand: Woodhead Publishing
Price: 184.29 GBP
Availability: InStock

Applied Optics

About as cheap as it gets. The only time it was cheaper was 6 months ago.

£184 today · all-time low £178 (Oct 2025) · usually the usual

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Description

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Product Specifications

Brand: Woodhead Publishing
Format: paperback
ASIN: 012821791X
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Electronics & Communications Engineering > Electronics Engineering > Applied Optics
Domain: Amazon UK
Release Date: 24 September 2021
Listed Since: 11 January 2020

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Woodhead Publishing Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials)

About as cheap as it gets. The only time it was cheaper was 6 months ago.

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