£109.82

Springer ELFNET Book: Lead-Free Solder Interconnects Guide

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Description

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects provides essential research from the European network ELFNET. Founded by the European Commission in the 6th Framework Programme, this work compiles technical insights from leading European experts specializing in lead-free soldering. A primary focus of this text is addressing the limitations of testing methods originally designed for tin-lead solder. Because these older methods may not apply to modern materials, the ELFNET reliability group developed this resource to bridge the gap. The book covers the material properties of lead-free solders and the fundamental basics required for effective implementation. This publication serves as a technical resource for professionals needing to understand the specific behaviors and quality concerns associated with lead-free interconnects. By bringing together expert contributions, it offers a comprehensive look at the challenges and solutions in contemporary soldering technology.

Key Features

Expert technical contributions from leading European specialists in the field of lead-free soldering.

Detailed analysis of failure mechanisms and quality issues specific to lead-free solder interconnects.

Addresses the limitations of traditional tin-lead solder testing methods in modern applications.

Comprehensive overview of the material properties found in various lead-free solder types.

Developed through the European Commission's 6th Framework Programme via the ELFNET network.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
14 May 2011
Listed Since
08 October 2010

Barcode

No barcode data available

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