£71.08

Springer Lead Free Solder: Mechanics and Reliability Book

33358650

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£71.08 £67.53 £68.95 £70.37 £71.79 £73.21 £74.63 27 January 2026 18 February 2026 13 March 2026 04 April 2026 27 April 2026

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Description

Lead-free solders are essential interconnection materials in modern electronic assemblies. They play a significant role in the global semiconductor packaging and electronics manufacturing industry. As consumer electronics like smartphones, notebooks, and high-performance computers continue to advance, they depend heavily on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability offers the technical depth needed to understand these processes. This book provides in-depth design knowledge regarding lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior. It is a valuable resource for professionals and engineers looking to apply these principles to the failure assessment of solder joint reliability. By understanding the mechanics behind these materials, you can better address the requirements of modern electronics manufacturing.

Key Features

Provides in-depth design knowledge regarding the elastic-plastic-creep behavior of lead-free solder.

Covers strain-rate dependent deformation behavior for improved engineering analysis.

Supports failure assessment of solder joint reliability in electronic assemblies.

Addresses the role of lead-free solder in semiconductor packaging and manufacturing.

Applicable to the development of smartphones, notebooks, and high-performance computers.

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