£358.12

CRC Press Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Mechanical Engineering)

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Description

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
27 February 2004
Listed Since
17 February 2007

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