£155.47

Springer Solder Joint Technology: Materials, Properties, and Reliability

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£155.47 £136.88 £140.94 £144.99 £149.05 £153.10 £157.16 09 May 2026 27 May 2026 15 June 2026 03 July 2026 22 July 2026

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31 days 43 days 1 day · current 0 11 22 32 43 £139 £146 £155 Days at Price

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Description

Solder joints are a fundamental component in electronic consumer products. As the industry moves away from lead-based (Pb) solders due to European Union directives, understanding solder joint behavior becomes essential for modern manufacturing. This text from the Springer Series in Materials Science (Volume 92) addresses the urgent need for research into lead-free solder development and performance. Readers will examine the complex challenges facing electronic reliability, such as spontaneous Sn whisker growth and failure caused by electromigration. Because solder joint reliability is affected by a combination of electrical, mechanical, chemical, and thermal forces, this book provides the necessary technical foundation to analyze and improve these connections. It serves as a resource for those studying the transition to lead-free materials and the technical requirements of contemporary electronics manufacturing.

Key Features

Covers the transition to lead-free solders driven by European Union directives and manufacturing needs.

Addresses critical reliability issues like spontaneous Sn whisker growth in electronic components.

Provides analysis on electromigration-induced failure within solder joints.

Explains the combined effects of electrical, mechanical, chemical, and thermal forces on solder reliability.

Part of the Springer Series in Materials Science, Volume 92, for technical depth.

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
19 November 2010
Listed Since
14 June 2010

Barcode

No barcode data available

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