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Springer Solder Joint Technology - Materials and Reliability

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£155.47 £135.54 £139.89 £144.24 £148.58 £152.93 £157.28 11 August 2026 25 August 2026 09 September 2026 24 September 2026 09 October 2026
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Description

Solder joints are essential components in nearly all electronic consumer products. This volume from the Springer Series in Materials Science (92) addresses the urgent research needs caused by the European Union's directive to ban lead-based (Pb) solders. As the industry moves toward lead-free alternatives, understanding solder joint behavior under various driving forces becomes necessary for successful electronic manufacturing. The text explores serious technical challenges such as spontaneous Sn whisker growth and failure induced by electromigration. Because analyzing and improving reliability is complex due to the combined effects of electrical, mechanical, chemical, and thermal forces, this resource provides the technical foundation required to study these interactions. It is a vital reference for those working to develop and implement reliable lead-free solder technologies.

Key Features

This Springer Series in Materials Science volume (92) covers the essential materials and properties of solder joints.

The text addresses the industry shift toward lead-free solders following European Union directives.

Research topics include the study of spontaneous Sn whisker growth and electromigration-induced failure.

The content examines how electrical, mechanical, chemical, and thermal forces affect solder joint reliability.

This book provides technical insights into the behavior of solder joints under various driving forces in manufacturing.

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
19 November 2010
Listed Since
14 June 2010

Barcode

No barcode data available

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