Springer Solder Joint Technology: Materials, Properties, and Reliability

Solder joints are a fundamental component in electronic consumer products. As the industry moves away from lead-based (Pb) solders due to European Union directives, understanding solder joint behavior becomes essential for modern manufacturing. This text from the Springer Series in Materials Science (Volume 92) addresses the urgent need for research into lead-free solder development and performance. Readers will examine the complex challenges facing electronic reliability, such as spontaneous Sn whisker growth and failure caused by electromigration. Because solder joint reliability is affected by a combination of electrical, mechanical, chemical, and thermal forces, this book provides the necessary technical foundation to analyze and improve these connections. It serves as a resource for those studying the transition to lead-free materials and the technical requirements of contemporary electronics manufacturing.