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Springer Solder Joint Reliability Prediction for Multiple Environments

Amazon

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£82.69 £82.14 £82.26 £82.38 £82.50 £82.62 £82.74 11 August 2026 25 August 2026 09 September 2026 23 September 2026 08 October 2026
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Description

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
23 October 2008
Listed Since
02 May 2008

Barcode

No barcode data available

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