£125.19

Elsevier Reflow Soldering: Apparatus and Heat Transfer Processes

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£125 today · all-time low £123 (Apr 2026) · usually the usual

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Last 52 days · 52 data points (no recent data)

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£126.89 £123.03 £123.87 £124.71 £125.56 £126.40 £127.24 27 April 2026 09 May 2026 22 May 2026 04 June 2026 17 June 2026

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6 days 22 days 19 days · current 5 days 0 6 11 17 22 £123 £124 £125 £127 Days at Price

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Most common price: £124 (22 days, 42.3%)

Price range: £123 - £127

Price levels: 4 different prices over 52 days

Description

Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles Analyses and compares the different reflow ovens Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality Introduces Vapor Phase Soldering (VPS) technology

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
15 July 2020
Listed Since
01 October 2019

Barcode

No barcode data available

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