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Springer Chip On Board: Technology for Multichip Modules

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£139.69 £132.71 £135.50 £138.29 £141.09 £143.88 £146.67 11 August 2026 01 September 2026 22 September 2026 13 October 2026 04 November 2026
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Description

This comprehensive guide from Springer provides a complete overview of the current state of Chip On Board (COB) technology. Designed for professionals in research and development, this book offers practical methods for solving COB and Multichip Module (MCM) challenges. It serves as a vital resource for those selecting cost-effective designs and high-yield manufacturing processes for interconnect systems. Whether you are working in electronic packaging or integrated systems, this text covers essential topics including design, materials, and manufacturing processes. It provides technical insights for engineers and managers focused on equipment, quality, reliability, and packaging. This timely summary of progress helps technical leaders make informed decisions regarding modern electronic interconnect systems.

Key Features

This Springer publication serves as a one-stop guide to the latest developments in COB technology.

The book provides problem-solving methods specifically for professionals working in COB and MCM research and development.

It offers guidance for choosing cost-effective designs and high-yield manufacturing processes for interconnect systems.

Content covers a wide range of technical needs including design, materials, process, and equipment.

This resource supports engineers and technical managers working in electronic packaging, quality, and reliability.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
30 June 1994
Listed Since
22 January 2007

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No barcode data available

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