Out of stock

This item is currently unavailable

Gone for 290 days. Could come back at any time — we're watching for you.

Out of stock 290 days · last price £171

InterPACK 2020 Proceedings - Electronic Packaging Papers

Amazon

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 726 days · 726 data points (no recent data)

Historical
Generating forecast…
£171.00 £162.45 £165.87 £169.29 £172.71 £176.13 £179.55 10 November 2024 10 May 2025 07 November 2025 07 May 2026 05 November 2026
View at Amazon ↗
Out of stock

Price data checked 5 days ago

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↑ Price chart
when this has been cheap or pricey
↑ Forecast
where the price is heading next
↓ Statistics
all-time high & low, recent range
↑ Price alert
name your number, we'll email you

Price Distribution

Price distribution over 726 days • 1 price levels

Days at Price
726 days 0 182 363 545 726 £171 Days at Price

Price Analysis

Most common price: £171 (726 days, 100.0%)

Price range: £171 - £171

Price levels: 1 different prices over 726 days

Description

This ASME publication contains the official proceedings from the 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. It provides a comprehensive collection of 65 research papers focused on advanced technical developments in the field. Readers gain access to specialized studies covering critical modern technologies, including Servers of the Future, Edge, and Cloud Computing. The collection also explores essential advancements in Autonomous, Hybrid, and Electric Vehicles, as well as developments in Power Electronics. This volume serves as a technical resource for professionals and researchers studying the integration of electronic and photonic microsystems.

Key Features

Includes 65 research papers from the InterPACK 2020 international conference.

Covers technical subjects such as Edge, Cloud, and Servers of the Future.

Provides detailed information on Power Electronics and microsystems integration.

Features research related to Autonomous, Hybrid, and Electric Vehicles.

Published by the American Society of Mechanical Engineers for technical accuracy.

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
31 March 2024
Listed Since
28 February 2021

Barcode

No barcode data available

Similar Products You Might Like

Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)
98% match

Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)

Price unavailable
96% match

Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018)

Price unavailable
2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 1
96% match

2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 1

Price unavailable
96% match

ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Volume 1: Thermal Management

Price unavailable
Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)
96% match

Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)

Price unavailable
96% match

Print Proceedings of the ASME 2016 International Mechanical Engineering Congress and Exposition (IMECE2016): Micro and Nano-Systems Engineering and Packaging Volume 10

Price unavailable
96% match

ASME Interpack Conference 2009 Proceedings - San Francisco

Price unavailable
96% match

Proceedings of the Asme Interpack Conference--2009: Presented at 2009 Asme Interpack Conference: July 19-23, 2009, San Francisco, California, USA

Price unavailable
Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)
95% match

Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

Price unavailable
95% match

ASME 2014 Micro-and Nano-Systems Engineering Volume 10

Price unavailable
95% match

Proceedings of the ASME 2020 International Mechanical Engineering Congress and Exposition (IMECE2020) Volume 13: Micro- and Nano-Systems Engineering and Packaging

Price unavailable
95% match

ASME 2020 15th International Manufacturing Science and Engineering Conference (MSEC2020) Volume 1B: Additive Manufacturing; Advanced Materials ... Manufacturing Equipment and Automation

Price unavailable
CRC Press Mechanical Analysis of Electronic Packaging Systems
95% match

CRC Press Mechanical Analysis of Electronic Packaging Systems

CRC Press

£188.20 09 Nov 2026
95% match

ASME 2021 16th International Manufacturing Science and Engineering Conference (MSEC2021) Volume 2: Manufacturing Processes; Manufacturing Systems; ... Manufacturing; Quality and Reliability

Price unavailable
Proceedings of the 2007 Asme Interpack Conference: July 8-12-2007, Vancouver, Bc, Canada: 2
95% match

Proceedings of the 2007 Asme Interpack Conference: July 8-12-2007, Vancouver, Bc, Canada: 2

Price unavailable
95% match

ASME 2020 15th International Manufacturing Science and Engineering Conference (MSEC2020) Volume 2A: Manufacturing Processes; Manufacturing Systems; ... Manufacturing; Quality and Reliability

Price unavailable
95% match

ASME 2014 International Mechanical Engineering Congress Vol 14

Price unavailable
95% match

Proceedings of the ASME 2021 International Mechanical Engineering Congress and Exposition (IMECE2021) Volume 3: Advanced Materials: Design, Processing, Characterization, and Applications

Price unavailable
Polymeric Materials for Microelectronics and Photonics Applications: Mechanics Physics Reliability Processing
95% match

Polymeric Materials for Microelectronics and Photonics Applications: Mechanics Physics Reliability Processing

Price unavailable
95% match

ASME 2008 International Design Engineering Proceedings v. 1

Price unavailable
2013 Proceedings of the ASME 2013 International Mechanical Engineering Congress and Exhibition (IMECE2013): Volume 2 Parts A & B: Advanced Manufacturing
95% match

2013 Proceedings of the ASME 2013 International Mechanical Engineering Congress and Exhibition (IMECE2013): Volume 2 Parts A & B: Advanced Manufacturing

Price unavailable
95% match

ASME DETC2016 Volume 3 - Design Engineering Proceedings

Price unavailable
95% match

ASME IMECE 2017 Proceedings Vol 14 - Emerging Technologies

Price unavailable
95% match

Print Proceedings of the ASME 2015 International Mechanical Engineering Congress and Exposition (IMECE2015): Volume 2B: Advanced Manufacturing

Price unavailable