Out of stock

This item is currently unavailable

Gone for 290 days. Could come back at any time — we're watching for you.

Out of stock 290 days · last price £315

ASME Interpack Conference 2009 Proceedings - San Francisco

Amazon

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 725 days · 725 data points (no recent data)

Historical
Generating forecast…
£315.00 £299.25 £305.55 £311.85 £318.15 £324.45 £330.75 10 November 2024 10 May 2025 07 November 2025 07 May 2026 04 November 2026
View at Amazon ↗
Out of stock

Price data checked 6 days ago

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↑ Price chart
when this has been cheap or pricey
↑ Forecast
where the price is heading next
↓ Statistics
all-time high & low, recent range
↑ Price alert
name your number, we'll email you

Price Distribution

Price distribution over 725 days • 1 price levels

Days at Price
725 days 0 181 363 544 725 £315 Days at Price

Price Analysis

Most common price: £315 (725 days, 100.0%)

Price range: £315 - £315

Price levels: 1 different prices over 725 days

Description

Access the official proceedings from the 2009 ASME Interpack Conference held in San Francisco, California. This collection features technical research and developments presented during the event from July 19-23, 2009. The volume includes contributions organized under the leadership of General Chair Jeffrey C. Suhling, Co-General Chair Masaru Ishizuka, and Technical Program Chair Sandeep Tonapi. This publication serves as a professional resource for engineers and researchers in the fields of electronics and communications engineering, providing documented insights from this specific ASME gathering.

Key Features

Contains the complete proceedings from the 2009 ASME Interpack Conference held in San Francisco, California.

Includes technical content presented between July 19 and July 23, 2009.

Features organized research led by General Chair Jeffrey C. Suhling and Co-General Chair Masaru Ishizuka.

Provides technical program insights curated by Technical Program Chair Sandeep Tonapi.

Serves as a specialized resource for professionals in electronics and communications engineering.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
15 January 2009
Listed Since
12 June 2010

Barcode

No barcode data available

Similar Products You Might Like

99% match

Proceedings of the Asme Interpack Conference--2009: Presented at 2009 Asme Interpack Conference: July 19-23, 2009, San Francisco, California, USA

Price unavailable
Proceedings of the 2007 Asme Interpack Conference: July 8-12-2007, Vancouver, Bc, Canada: 2
98% match

Proceedings of the 2007 Asme Interpack Conference: July 8-12-2007, Vancouver, Bc, Canada: 2

Price unavailable
Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)
96% match

Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)

Price unavailable
Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference and Exhibition: Interpack 97 (EEP)
96% match

Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference and Exhibition: Interpack 97 (EEP)

Price unavailable
96% match

Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018)

Price unavailable
Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)
96% match

Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)

Price unavailable
96% match

ASME MSEC 2007 International Manufacturing Science Proceedings

Price unavailable
96% match

InterPACK 2020 Proceedings - Electronic Packaging Papers

Price unavailable
96% match

ASME 2009 International Mechanical Engineering Proceedings

Price unavailable
96% match

Proceedings of the Asme International Mechanical Engineering Congress and Exposition--2009: Presented at 2009 Asme International Mechanical ... 13-19, 2009, Lake Buena Vista, Florida, USA

Price unavailable
96% match

Proceedings of the Asme International Mechanical Engineering Congress and Exposition--2009: Presented at 2009 Asme International Mechanical ... 13-19, 2009, Lake Buena Vista, Florida, USA

Price unavailable
96% match

ASME 2009 International Mechanical Engineering Proceedings

Price unavailable
96% match

ASME 2009 International Mechanical Engineering Congress

Price unavailable
ASME International Mechanical Engineering Congress 2009
96% match

ASME International Mechanical Engineering Congress 2009

Price unavailable
96% match

ASME 2009 International Mechanical Engineering Proceedings

Price unavailable
96% match

Proceedings of the Asme International Mechanical Engineering Congress and Exposition--2009: Presented at 2009 Asme International Mechanical ... 13-19, 2009, Lake Buena Vista, Florida, USA

Price unavailable
96% match

Proceedings of the Asme International Mechanical Engineering Congress and Exposition--2009: Presented at 2009 Asme International Mechanical ... 13-19, 2009, Lake Buena Vista, Florida, USA

Price unavailable
European Packaging Machinery Outlook 2013-2018 Study
95% match

European Packaging Machinery Outlook 2013-2018 Study

£325.00 10 Nov 2026
ASME Design and Manufacturing Vol 3 - Engineering Congress
95% match

ASME Design and Manufacturing Vol 3 - Engineering Congress

Price unavailable
95% match

2012 Proceedings of the ASME International Mechanical Engineering Congress and Exposition (IMECE2012) - Volume 9: Parts A&B, Micro-and Nano-Systems Engineering and Packaging

Price unavailable
The 2007 Import and Export Market for Sacks and Bags Made of Manmade Textile Used for Packing Goods in United Kingdom
95% match

The 2007 Import and Export Market for Sacks and Bags Made of Manmade Textile Used for Packing Goods in United Kingdom

£138.00 25 Aug 2026
Packaging Machinery in Africa 2013-2018 Outlook Study
95% match

Packaging Machinery in Africa 2013-2018 Outlook Study

£325.00 06 Nov 2026
2013 Middle East Wood Packing Cases and Drums Market Report
95% match

2013 Middle East Wood Packing Cases and Drums Market Report

£325.00 02 Nov 2026
Sustainable Packaging Services Middle East Outlook 2013-2018
95% match

Sustainable Packaging Services Middle East Outlook 2013-2018

£325.00 10 Nov 2026