£294.38

Springer Advances in Rapid Thermal and Integrated Processing: 318 (NATO Science Series E:, 318)

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£306.72 £293.15 £296.11 £299.07 £302.03 £304.99 £307.95 10 June 2026 27 June 2026 15 July 2026 02 August 2026 20 August 2026

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Description

Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
31 March 1996
Listed Since
16 February 2007

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