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Springer Substrate Noise Coupling in Mixed-Signal ASICs - Springer

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Description

This foundational text explores substrate noise coupling in mixed-signal ASIC design, addressing one of the most critical challenges in modern microelectronics. As the first volume in a three-part series on advanced mixed-signal IC design methodologies, this book draws on research from the Mixed-Signal Design Cluster, an initiative launched in 1998 through the TARDIS project funded by the European Commission's ESPRIT-IV Framework. The work provides industrial-grade design and test methodologies specifically developed to accelerate the adoption of mixed-signal techniques across the semiconductor industry. With microelectronics applications expanding rapidly, understanding substrate noise coupling has become essential for engineers designing high-performance ICs where analogue and digital circuits operate on the same chip. This comprehensive resource equips design teams with the knowledge needed to mitigate noise-related issues and improve overall chip reliability and performance in complex mixed-signal systems.

Key Features

First volume in a dedicated three-part series on advanced mixed-signal IC design methodologies and substrate noise management.

Developed through the Mixed-Signal Design Cluster research initiative, funded by the European Commission's ESPRIT-IV Framework programme.

Provides practical design and test methodologies specifically developed for mixed-signal ASIC applications in industrial settings.

Addresses substrate noise coupling challenges in modern microelectronics where analogue and digital circuits integrate on the same silicon die.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
28 February 2003
Listed Since
15 February 2007

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