£113.58

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£114 today · all-time low £109 (Jul 2026) · usually £113

Springer SISPAD 2007 Semiconductor Processes Simulation Conference Proceedings

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Description

This volume contains the proceedings of the 12th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held in September 2007 in Vienna, Austria. The collection presents cutting-edge research and developments in theoretical descriptions, physical modelling, and numerical simulation of semiconductor fabrication processes, device operation, and system performance. Published by Springer, this conference proceedings offers a comprehensive global forum for advances in semiconductor simulation technology, making it an essential reference for researchers, engineers, and academics working in semiconductor design, process engineering, and device physics. The papers cover innovations in simulation methodologies and analytical approaches that have shaped the semiconductor industry's understanding of fabrication challenges and performance optimisation.

Key Features

SISPAD 2007 proceedings from the 12th International Conference held in Vienna, Austria during September 2007.

Comprehensive coverage of theoretical descriptions and physical modelling in semiconductor process simulation.

Collection features research on numerical simulation and analysis of semiconductor device operation and system performance.

Published by Springer as an authoritative reference for semiconductor fabrication process advances.

Global forum proceedings presenting recent developments and innovations in semiconductor simulation technology.

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
30 April 2017
Listed Since
23 March 2017

Barcode

No barcode data available

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