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Springer SISPAD 2007 - Semiconductor Simulation Proceedings

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Description

Explore the latest research in semiconductor technology with Simulation of Semiconductor Processes and Devices 2007: SISPAD 2007. Published by Springer, this volume serves as the official proceedings from the 12th International Conference on Simulation of Semiconductor Processes and Devices held in Vienna, Austria. This collection offers a comprehensive look at recent developments in the field. It covers a wide range of topics including theoretical descriptions, physical modeling, and numerical simulations. Readers can find detailed analysis regarding semiconductor fabrication processes, device operation, and system performance. Whether you are researching semiconductor fabrication or studying device operation, this book provides a global forum of expert perspectives. It is a valuable resource for professionals and students interested in the modeling and analysis of semiconductor systems.

Key Features

Contains the full proceedings from the 12th International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2007).

Provides detailed research on the theoretical description and physical modeling of semiconductor technologies.

Includes advanced numerical simulation and analysis techniques for semiconductor fabrication processes.

Covers essential topics regarding device operation and overall system performance.

Offers a global perspective through discussions of recent advances and developments in the semiconductor industry.

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
30 April 2017
Listed Since
23 March 2017

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