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Springer SISPAD 2007 - Semiconductor Processes and Devices

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Description

Expand your technical knowledge with Simulation of Semiconductor Processes and Devices 2007: SISPAD 2007. Published by Springer, this volume captures the proceedings from the Twelfth International Conference held at TU Wien in Vienna, Austria. As a leading forum for Technology Computer-Aided Design (TCAD), SISPAD provides a global platform for the presentation and discussion of recent developments in the field. This collection follows a long history of academic excellence, tracing its roots back to the first conference in Tokyo in 1996 and its predecessors NUPAD, VPAD, and SISDEP. This book serves as a vital resource for researchers and professionals seeking to understand the latest advancements in semiconductor simulation. By bringing together international expertise, it offers a comprehensive look at the research driving the semiconductor industry forward.

Key Features

Comprehensive coverage of the Twelfth International Conference on Simulation of Semiconductor Processes and Devices held at TU Wien.

A leading resource for Technology Computer-Aided Design (TCAD) research and developments.

Includes academic discussions and presentations from a worldwide forum of experts.

Traces the historical progression of semiconductor simulation from NUPAD, VPAD, and SISDEP to the modern SISPAD series.

Published by Springer, ensuring high standards for technical and scientific academic content.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
18 September 2007
Listed Since
11 May 2007

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