Designing Electronic Product Enclosures - Image 1

£98.30

Springer Designing Electronic Product Enclosures

Name: Designing Electronic Product Enclosures
Brand: Springer
Price: 98.3 GBP
Availability: InStock

Materials Science

It has never been this cheap. We have no record of a lower price.

£98 today · cheaper than every other day in the last 3 months

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↓ Price chart
when this has been cheap or pricey

↓ Forecast
where the price is heading next

↓ Statistics
all-time high & low, recent range

↑ Price alert
name your number, we'll email you

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 76 days · 76 data points (no recent data)

Historical

Generating forecast…

Price Distribution

Price distribution over 76 days • 1 price levels

Days at Price

Price Analysis

Most common price: £98 (76 days, 100.0%)

Price range: £98 - £98

Price levels: 1 different prices over 76 days

Description

This book explains the design and fabrication of any electronic enclosure that contains a printed circuit board, from original design through materials selection, building and testing, and ongoing design improvement. It presents a thorough and lucid treatment of material physical properties, engineering, and compliance considerations such that readers will understand concerns that exist witha design (structural, environmental, and regulatory) and what is needed to successfully enter the marketplace. To this end, a main thrust of this volume is on the “commercialization” of electronic products when an enclosure is needed. The book targets the broadest audience tasked with design and manufacture of an enclosure for an electronic product, from mechanical/industrial engineers to designers and technicians. Compiling a wealth of information on relevant physical phenomena (strength of materials, shock and vibration, heat transfer), the book stands as a ready reference on how and where these key properties may be considered in the design of most electronic enclosures.

Product Specifications

Brand: Springer
Format: hardcover
ASIN: 3319693948
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Mechanical & Materials Engineering > Materials Science
Domain: Amazon UK
Release Date: 09 August 2018
Listed Since: 13 September 2017

Barcode

No barcode data available

Springer Designing Electronic Product Enclosures

It has never been this cheap. We have no record of a lower price.

Price History & Forecast

Price Distribution

Price Analysis

Description

Product Specifications

Barcode

Similar Products You Might Like

Designing Electronic Product Enclosures

CRC Press Electronic Packaging Materials and Their Properties

Electronic Equipment Packaging Technology

Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition

Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition

William Andrew - Encapsulants for Electronic Applications

Wiley Thermal Management Materials for Electronic Packaging

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Principles of Microelectromechanical Systems (IEEE Press)

Mechanical Analysis of Electronic Packaging Systems: 120 (Mechanical Engineering (Marcel Dekker Hardcover))

3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)

Materials for Advanced Packaging

Materials for Advanced Packaging

Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications)

Architectural Electromagnetic Shield P: A Design and Specification Guide

Encapsulation Technologies for Electronic Applications

Semiconductor Packaging: Materials Interaction and Reliability

Semiconductor Packaging: Materials Interaction and Reliability

Creo Parametric 11.0 Black Book (Edition9)

Extreme Environment Electronics (Industrial Electronics)

Autodesk Fusion 360 Black Book (V 2.0.18477) Part I

Autodesk Fusion 360 Black Book (V 2.0.18477) Part I

Mechanics of Microelectronics: 141 (Solid Mechanics and Its Applications, 141)