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£73.10
Springer Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Price data checked 2 days ago
Price History & Forecast
Last 89 days • 89 data points
Price Distribution
Price distribution over 89 days • 5 price levels
Current Price
Price Analysis
Most common price: £73 (55 days, 61.8%)
Price range: £65 - £73
Price levels: 5 different prices over 89 days
Description
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
Product Specifications
- Brand
- Springer
- Format
- hardcover
- ASIN
- 3319023772
- Category
- Books > Subjects > Computing & Internet > Computer Science > Architecture & Microprocessors
- Domain
- Amazon UK
- Release Date
- 02 December 2013
- Listed Since
- 15 August 2013
Barcode
No barcode data available
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