£74.42

Springer Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)

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£74 today · all-time low £74 (May 2026) · usually £74

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Description

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
23 August 2016
Listed Since
21 July 2016

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