We can't find the internet
Attempting to reconnect
Something went wrong
Hang in there while we get back on track
£61.56
About as cheap as it gets — within 5% of the all-time low it hit 2 months ago.
£62 today · all-time low £59 (Aug 2026) · usually £61
World Scientific Publishing Company DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS: 2 (WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING)
Price data last checked 16 day(s) ago - will refresh soon
We'll watch every seller, every day. One email when your price arrives.
Price History & Forecast
Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.
Last 75 days · 75 data points (no recent data)
Price data last checked 16 day(s) ago - will refresh soon
NEW HERE?
Amazon shows you one price. We show you all of them.
Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.
WHAT'S ON THIS PAGE
when this has been cheap or pricey
where the price is heading next
all-time high & low, recent range
name your number, we'll email you
Price Distribution
Price distribution over 75 days • 4 price levels
Price Analysis
Most common price: £60 (28 days, 37.3%)
Price range: £59 - £62
Price levels: 4 different prices over 75 days
Description
Product Specifications
- Format
- hardcover
- ASIN
- 9814508594
- Domain
- Amazon UK
- Release Date
- 05 January 2014
- Listed Since
- 10 May 2013
Barcode
No barcode data available
Similar Products You Might Like
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Springer
Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)
Springer
Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)
Springer
EMBEDDED DIELECTRICS FOR ELECTRONIC PACKAGING: 0 (WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING)
World Scientific Publishing Company
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Springer
Technology of Integrated Circuits: 2 (Springer Series in Advanced Microelectronics, 2)
Springer
Integrated Optics: Design and Modeling (Optoelectronics Library)
Artech House
3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems)
Springer
CO-DESIGN AND MODELLING FOR ADVANCED INTEGRATION AND PACKAGING: MANUFACTURING AND RELIABILITY: 0 (WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING)
World Scientific Publishing Company
Semiconductor Integrated Circuit: Device Design, Modeling, Simulation, and Application
CRC Press
Computer Aided Design Of Micro- And Nanoelectronic Devices
World Scientific Publishing Company
Designing 2D and 3D Network-on-Chip Architectures
Springer
Semiconductor Power Devices: Volume 2: Packaging, Thermal aspects, Reliability and Ruggedness
Springer
Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D and 3D Integration, Hybrid Bonding, and Thermal Design for Multi-Die Systems
Semiconductor Device Modelling
Springer
Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology
CRC Press
Interconnects in VLSI Design
Springer
Integrierte Digitale Schaltungen: Vom Transistor zur optimierten Logikschaltung
Springer
Bio/CMOS Interfaces and Co-Design
Springer
Bio/CMOS Interfaces and Co-Design
Springer
Silicon Photonics II: Components and Integration: 119 (Topics in Applied Physics, 119)
Springer
Semiconductor Device Physics and Design
Springer
Packaging of High Power Semiconductor Lasers (Micro- and Opto-Electronic Materials, Structures, and Systems)
Springer
Bsim4 And Mosfet Modeling For Ic Simulation
World Scientific Publishing Company