Springer Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

This volume encompasses the latest, innovative methods of testing three-dimensional integrated circuits, incorporating pre-bond and post-bond tests as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective. From the Back Cover This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects.  The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain.  Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization.  Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.   • Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICs; • Includes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule optimizations; • Encompasses all aspects of test as related to 3D ICs, including pre-bond and post-bond test as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.   About the Author Krishnendu Chakrabarty is a Professor of Electrical and Computer Engineering at Duke University. He received his PhD from University of Michigan. He is a Fellow of IEEE and a Distinguished Engineer of ACM.