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£790.00
It has never been this cheap. We have no record of a lower price.
£790 today · cheaper than every other day in the last 3 months
The 2025-2030 World Outlook for System in Package (SiP) Technologies
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Price History & Forecast
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Last 68 days · 68 data points (no recent data)
Historical
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Price Distribution
Price distribution over 68 days • 1 price levels
Price Analysis
Most common price: £790 (68 days, 100.0%)
Price range: £790 - £790
Price levels: 1 different prices over 68 days
Description
This study covers the world outlook for system in package (SiP) technologies across more than 190 countries. For each year reported, estimates are given for the latent demand, or potential industry earnings (P.I.E.), for the country in question (in millions of U.S. dollars), the percent share the country is of the region, and of the globe. These comparative benchmarks allow the reader to quickly gauge a country vis-à-vis others. Using econometric models which project fundamental economic dynamics within each country and across countries, latent demand estimates are created. This report does not discuss the specific players in the market serving the latent demand, nor specific details at the product level. The study also does not consider short-term cyclicalities that might affect realized sales. The study, therefore, is strategic in nature, taking an aggregate and long-run view, irrespective of the players or products involved. In this report we define the sales of system in package (SiP) technologies as including all commonly understood products falling within this broad category, such as 2D, 2.5D, and 3D integrated circuit (IC) technologies; ball grid array (BGA), surface mount package, pin grid array (PGA), flat package, and small outline package packaging; flip-chip and wire-bond interconnection technologies; and system in package (SIP) used within the communication, consumer, automotive, and medical industries, irrespective of product packaging, formulation, size, or form. Companies participating in this industry include Amkor Technology, ASE, Chipbond Technology, Chipmos Tech., Fujitsu, GS Nanotech, Insight SiP, Intel Corporation, Jiangsu Changjiang Electronics Technology Company, NXP Semiconductors, Powertech Technologies, Renesas Electronics Corporation, Samsung, ShunSin Technology Holdings, Ltd., Si2 Microsystems Private, Siliconware Precision Industries Company, STATS ChipPAC, Texas Instruments, Unisem, and UTAC.. In addition to the sources indicated, additional information available to the public via news and/or press releases published by players in the industry was considered in defining and calibrating this category. All figures are in a common currency (U.S. dollars, millions) and are not adjusted for inflation (i.e., they are current values). Exchange rates used to convert to U.S. dollars are averages for the year in question. Future exchange rates are assumed to be constant in the future at the current level (the average of the year of this publication's release in 2024).
Product Specifications
- Format
- paperback
- ASIN
- B0CZM2SGQ5
- Category
- Books > Subjects
- Domain
- Amazon UK
- Release Date
- 03 March 2024
- Listed Since
- 06 May 2024
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