£118.40

It has never been this cheap. We have no record of a lower price.

£118 today · cheaper than every other day in the last 3 months

Springer Conceptual Design of Multichip Modules and Systems: 250 (The Springer International Series in Engineering and Computer Science, 250)

View at Amazon

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 55 days · 55 data points (no recent data)

Historical
Generating forecast…
£118.40 £112.48 £114.85 £117.22 £119.58 £121.95 £124.32 23 July 2026 05 August 2026 19 August 2026 01 September 2026 15 September 2026
View at Amazon ↗

Price data last checked 36 day(s) ago - refreshing...

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↑ Price chart
when this has been cheap or pricey
↑ Forecast
where the price is heading next
↓ Statistics
all-time high & low, recent range
↑ Price alert
name your number, we'll email you

Price Distribution

Price distribution over 55 days • 1 price levels

Days at Price
55 days 0 14 28 41 55 £118 Days at Price

Price Analysis

Most common price: £118 (55 days, 100.0%)

Price range: £118 - £118

Price levels: 1 different prices over 55 days

Description

Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
31 October 1993
Listed Since
12 January 2007

Barcode

No barcode data available

Similar Products You Might Like

Physical Design for Multichip Modules: 267 (The Springer International Series in Engineering and Computer Science, 267)
88% match

Physical Design for Multichip Modules: 267 (The Springer International Series in Engineering and Computer Science, 267)

Springer

£116.16 18 Aug 2026
Physical Design for Multichip Modules: 267 (The Springer International Series in Engineering and Computer Science, 267)
88% match

Physical Design for Multichip Modules: 267 (The Springer International Series in Engineering and Computer Science, 267)

Springer

£108.01 05 Aug 2026
The Synthesis Approach to Digital System Design: 170 (The Springer International Series in Engineering and Computer Science, 170)
83% match

The Synthesis Approach to Digital System Design: 170 (The Springer International Series in Engineering and Computer Science, 170)

Springer

£108.01 07 Aug 2026
Design for Manufacturability and Statistical Design: A Constructive Approach (Integrated Circuits and Systems)
83% match

Design for Manufacturability and Statistical Design: A Constructive Approach (Integrated Circuits and Systems)

Springer

£108.01 05 Aug 2026
Multi-Level Simulation for VLSI Design: 18 (The Springer International Series in Engineering and Computer Science, 18)
83% match

Multi-Level Simulation for VLSI Design: 18 (The Springer International Series in Engineering and Computer Science, 18)

Springer

£74.91 05 Aug 2026
High-Performance CMOS Continuous-Time Filters: 223 (The Springer International Series in Engineering and Computer Science, 223)
83% match

High-Performance CMOS Continuous-Time Filters: 223 (The Springer International Series in Engineering and Computer Science, 223)

Springer

£108.01 06 Aug 2026
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits: 302 (The Springer International Series in Engineering and Computer Science, 302)
82% match

Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits: 302 (The Springer International Series in Engineering and Computer Science, 302)

Springer

£107.85 06 Aug 2026
Multiprocessor Systems on Chip: Design Space Exploration
82% match

Multiprocessor Systems on Chip: Design Space Exploration

Springer

£76.42 05 Aug 2026
Models in System Design: 9 (Current Issues in Electronic Modeling, 9)
82% match

Models in System Design: 9 (Current Issues in Electronic Modeling, 9)

Springer

£142.47 06 Aug 2026
Algorithmic and Register-Transfer Level Synthesis: The System Architect’s Workbench: The System Architect's Workbench: 85 (The Springer International Series in Engineering and Computer Science, 85)
82% match

Algorithmic and Register-Transfer Level Synthesis: The System Architect’s Workbench: The System Architect's Workbench: 85 (The Springer International Series in Engineering and Computer Science, 85)

Springer

£113.98 31 Aug 2026
Modular System Design and Evaluation (Decision Engineering)
82% match

Modular System Design and Evaluation (Decision Engineering)

Springer

£75.71 18 Aug 2026
Multiprocessor System-on-Chip: Hardware Design and Tool Integration
82% match

Multiprocessor System-on-Chip: Hardware Design and Tool Integration

Springer

£91.25 07 Aug 2026
Multi-Chip Module Test Strategies: 7 (Frontiers in Electronic Testing, 7)
82% match

Multi-Chip Module Test Strategies: 7 (Frontiers in Electronic Testing, 7)

Springer

£73.85 04 Aug 2026
Mixed-Mode Simulation and Analog Multilevel Simulation: 279 (The Springer International Series in Engineering and Computer Science, 279)
82% match

Mixed-Mode Simulation and Analog Multilevel Simulation: 279 (The Springer International Series in Engineering and Computer Science, 279)

Springer

£109.75 05 Aug 2026
Methodology for the Modeling and Simulation of Microsystems: 2
82% match

Methodology for the Modeling and Simulation of Microsystems: 2

Springer

£81.21 08 Aug 2026
Multi-Disciplinary Engineering for Cyber-Physical Production Systems: Data Models and Software Solutions for Handling Complex Engineering Projects
82% match

Multi-Disciplinary Engineering for Cyber-Physical Production Systems: Data Models and Software Solutions for Handling Complex Engineering Projects

Springer

£112.84 21 Oct 2026
A Priori Wire Length Estimates for Digital Design
82% match

A Priori Wire Length Estimates for Digital Design

Springer

£111.59 18 Aug 2026
A Priori Wire Length Estimates for Digital Design
82% match

A Priori Wire Length Estimates for Digital Design

Springer

£108.01 05 Aug 2026
CMOS Memory Circuits
82% match

CMOS Memory Circuits

Springer

£152.06 05 Aug 2026
Mixed Design of Integrated Circuits and Systems: 434 (The Springer International Series in Engineering and Computer Science, 434)
82% match

Mixed Design of Integrated Circuits and Systems: 434 (The Springer International Series in Engineering and Computer Science, 434)

Springer

£78.13 05 Aug 2026
Multichip Modules with Integrated Sensors: 16 (NATO Science Partnership Subseries: 3, 16)
82% match

Multichip Modules with Integrated Sensors: 16 (NATO Science Partnership Subseries: 3, 16)

Springer

£76.42 06 Aug 2026
Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D and 3D Integration, Hybrid Bonding, and Thermal Design for Multi-Die Systems
82% match

Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D and 3D Integration, Hybrid Bonding, and Thermal Design for Multi-Die Systems

£55.59 14 Sep 2026
Models in System Design: 9 (Current Issues in Electronic Modeling, 9)
82% match

Models in System Design: 9 (Current Issues in Electronic Modeling, 9)

Springer

£162.95 29 Aug 2026
CMOS Integrated Capacitive DC-DC Converters (Analog Circuits and Signal Processing)
82% match

CMOS Integrated Capacitive DC-DC Converters (Analog Circuits and Signal Processing)

Springer

£76.38 06 Aug 2026