£108.61

Springer Foldable Flex and Thinned Silicon Multichip Packaging Technology: 1 (Emerging Technology in Advanced Packaging, 1)

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About as cheap as it gets. The only time it was cheaper was 3 months ago.

£109 today · all-time low £108 (Feb 2026) · usually £112

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£113.63 £107.35 £108.72 £110.09 £111.46 £112.83 £114.20 18 February 2026 12 March 2026 03 April 2026 25 April 2026 18 May 2026

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17 days 2 days · current 4 days 28 days 13 days 26 days 0 7 14 21 28 £108 £109 £110 £111 £112 £114 Days at Price

Price Analysis

Most common price: £111 (28 days, 31.1%)

Price range: £108 - £114

Price levels: 6 different prices over 90 days

Description

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Product Specifications

Format
paperback
Domain
Amazon UK
Publication Date
23 February 2014
Listed Since
06 August 2014

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