£110.57

Springer Foldable Flex and Thinned Silicon Multichip Packaging Technology: 1 (Emerging Technology in Advanced Packaging, 1)

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£111 today · all-time low £109 (May 2026) · usually £110

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£113.58 £108.11 £109.31 £110.50 £111.69 £112.88 £114.08 21 May 2026 09 June 2026 29 June 2026 19 July 2026 08 August 2026

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Most common price: £110 (40 days, 50.0%)

Price range: £109 - £114

Price levels: 5 different prices over 80 days

Description

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Product Specifications

Format
paperback
Domain
Amazon UK
Publication Date
23 February 2014
Listed Since
06 August 2014

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