Bonding in Microsystem Technology: 24 (Springer Series in Advanced Microelectronics, 24) - Image 1

£105.14

Springer Bonding in Microsystem Technology: 24 (Springer Series in Advanced Microelectronics, 24)

Name: Bonding in Microsystem Technology: 24 (Springer Series in Advanced Microelectronics, 24)
Brand: Springer
Price: 107.32 GBP
Availability: InStock

Mechanics

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Description

This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.

Product Specifications

Brand: Springer
Format: paperback
ASIN: 9048171512
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Civil Engineering > Mechanics
Domain: Amazon UK
Release Date: 25 November 2010
Listed Since: 01 October 2010

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Springer Bonding in Microsystem Technology: 24 (Springer Series in Advanced Microelectronics, 24)

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