We can't find the internet
Attempting to reconnect
Something went wrong
Hang in there while we get back on track
£106.40
Springer Bonding in Microsystem Technology: 24 (Springer Series in Advanced Microelectronics, 24)
Price data last checked 55 day(s) ago - refreshing...
We'll watch every seller, every day. One email when your price arrives.
This is the most expensive it has ever been. Walk away.
£106 today · previous high £106 · all-time low £106
NEW HERE?
Amazon shows you one price. We show you all of them.
Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.
WHAT'S ON THIS PAGE
when this has been cheap or pricey
where the price is heading next
all-time high & low, recent range
name your number, we'll email you
Price History & Forecast
Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.
Last 36 days · 36 data points (no recent data)
Price Distribution
Price distribution over 36 days • 1 price levels
Price Analysis
Most common price: £106 (36 days, 100.0%)
Price range: £106 - £106
Price levels: 1 different prices over 36 days
Description
Product Specifications
- Brand
- Springer
- Format
- paperback
- ASIN
- 9048171512
- Domain
- Amazon UK
- Release Date
- 25 November 2010
- Listed Since
- 01 October 2010
Barcode
No barcode data available
Similar Products You Might Like
Bonding by Self-Propagating Reaction: 45 (Materials Research Foundations)
Materials Research Forum LLC
Materials for Advanced Packaging
Springer
Materials for Advanced Packaging
Springer
Printed Organic and Molecular Electronics
Springer
Springer - Printed Organic and Molecular Electronics Book
Springer
Surface Treatment of Materials for Adhesion Bonding
William Andrew
Handbook of 3D Integration, Volume 3: 3D Process Technology
Wiley
SemiConductor Wafer Bonding: Science and Technology: 33 (The ECS Series of Texts and Monographs)
Wiley
Copper Wire Bonding
Springer
Functional Molecular Silicon Compounds II: Low Oxidation States: 156 (Structure and Bonding, 156)
Springer
Mechanics of Microelectronics: 141 (Solid Mechanics and Its Applications, 141)
Springer
Silcon Based MEMS Materials & Technologies (Micro & Nano Technologies)
Elsevier
Functional Molecular Silicon Compounds I: Regular Oxidation States: 155 (Structure and Bonding, 155)
Springer
Soldering Handbook For Printed Circuits and Surface Mounting (Electrical Engineering)
Springer
Semiconductor Advanced Packaging
Springer
Liquid Crystalline Functional Assemblies and Their Supramolecular Structures: 128 (Structure and Bonding, 128)
Springer
3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)
Springer
Polymeric Materials for Microelectronics and Photonics Applications: Mechanics Physics Reliability Processing
Price unavailable
Springer Molecular Nanomagnets and Related Phenomena - 164
Springer
Silicon Micromachining: 7 (Cambridge Studies in Semiconductor Physics and Microelectronic Engineering, Series Number 7)
Cambridge University Press
Semiconductor Advanced Packaging
Springer
Nitrosyl Complexes in Inorganic Chemistry, Biochemistry and Medicine II: 154 (Structure and Bonding, 154)
Springer
Semiconductor Spintronics
World Scientific Publishing Company
Liquid Crystalline Functional Assemblies and Their Supramolecular Structures: 128 (Structure and Bonding, 128)
Springer