Diffusion Characteristics Of Copper In Novel Metallic Films - Image 1

£70.00

VDM Verlag Diffusion Characteristics Of Copper In Novel Metallic Films

Name: Diffusion Characteristics Of Copper In Novel Metallic Films
Brand: VDM Verlag
Price: 70.0 GBP
Availability: InStock

Engineering & Technology

It has never been this cheap. We have no record of a lower price.

£70 today · cheaper than every other day in the last 3 months

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↓ Price chart
when this has been cheap or pricey

↓ Forecast
where the price is heading next

↓ Statistics
all-time high & low, recent range

↑ Price alert
name your number, we'll email you

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 68 days · 68 data points (no recent data)

Historical

Generating forecast…

Price Distribution

Price distribution over 68 days • 1 price levels

Days at Price

Price Analysis

Most common price: £70 (68 days, 100.0%)

Price range: £70 - £70

Price levels: 1 different prices over 68 days

Description

The goal of this work was to synthesize refractory materials like TiN, Ta and alloys of TiN-TaN in the form of thin films which are used as diffusion barriers in integrated circuits to prevent diffusion of Cu into the Si substrate. The primary emphasis of this research was to synthesize different microstructures of these films like amorphous, nanocrystalline, textured polycrystalline and single crystalline films, and to study the effect of these microstructures on their mechanical and electrical properties and on diffusion characteristics of Cu. Microstructures ranging from nanocrystalline to single crystalline TiN films on Si(100) substrates were synthesized by Pulsed Laser Deposition technique by varying the substrate temperature from 25°C to 650°C. Experimental techniques like XRD, TEM, HRTEM, STEM-Z, EELS, SIMS and four-point probe resistivity measurement were used for in-depth analysis. Effect of microstructures of these films on their mechanical and electrical properties, and on diffusion behavior of Cu was analyzed.

Product Specifications

Brand: VDM Verlag
Format: paperback
ASIN: 3639146263
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology
Domain: Amazon UK
Release Date: 08 May 2009
Listed Since: 27 May 2009

Barcode

No barcode data available

VDM Verlag Diffusion Characteristics Of Copper In Novel Metallic Films

It has never been this cheap. We have no record of a lower price.

Price History & Forecast

Price Distribution

Price Analysis

Description

Product Specifications

Barcode

Similar Products You Might Like

Growth of High Permittivity Dielectrics by High Pressure Sputtering from Metallic Targets (Springer Theses)

Photocatalytic Activity of Nanostructured Tin Oxide Thin Films: Effect of Metal Ion Dopants on Structural, Optical, and Photocatalytic Activities of SnO2 Nanostructured Thin Films

Nanoscaled Films and Layers

Cu(InGa)Se2 Based Thin Film Solar Cells (Thin Films and Nanostructures): Cu (In1-xGax)Se2 Based Thin Film Cells: Volume 35 (Thin Films and Nanostructures, Volume 35)

Surface Modifications and Growth of Titanium Dioxide for Photo-Electrochemical Water Splitting (Springer Theses)

Películas Delgadas Nanocompuestas: Nanopartículas Metálicas/Matrices Mesoporosas con Aplicaciones en Espectroscopía Raman Amplificada por Superficies

Microstructure and Properties of Micro- and Nanoscale Materials, Films, and Coatings (NAP 2019): Selected Articles from the International Conference ... 240 (Springer Proceedings in Physics, 240)

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (Springer Theses)

Studies of Nanoconstrictions, Nanowires and Fe3O4 Thin Films: Electrical Conduction and Magnetic Properties. Fabrication by Focused Electron/Ion Beam (Springer Theses)

GaP Heteroepitaxy on Si(100): Benchmarking Surface Signals when Growing GaP on Si in CVD Ambients (Springer Theses)

Thin Film Solar Cells from Abundant Materials: Growth and Characterization of Cu2(ZnSn)(SSe)4 Thin Films and Their Solar Cells (Elsevier Insights)

Electromigration in Thin Films and Electronic Devices: Materials and Reliability (Woodhead Publishing Series in Electronic and Optical Materials)

Whisker formation on Sn thin films: Experimental determination of the driving forces for spontaneous Sn whisker formation in the system Sn on Cu

Hall Effect Measurements & electrical study of CdS & ZnO nano Material: Advance Level Concepts

Nano-Raman spectroscopy and surface nanostructuring: using near-field optics

Metallic Films for Electronic, Optical and Magnetic Applications: Structure, Processing and Properties (Woodhead Publishing Series in Electronic and Optical Materials)

Functional thin films produced by plasma techniques: Study of titanium nitride and aluminum nitride functional films deposited on AISI M2 and AISI D6 substrates

CdS Based Thin Films for Spintronic Applications

Laser Surface Modification of Alloys for Erosion and Corrosion Resistance (Woodhead Publishing Series in Metals and Surface Engineering)

Optical properties of Copper Doped Zinc Sulphidenanoparticles: Electro- and Photoluminescence of ZnS Nanoparticles

Organic donor-acceptor thin film systems: towards optimized growth conditions

Production Of Thin Film Materials For Gas Sensors: A study of phthalocyanine-based plasma-deposited thin films for electrical and optical gas/vapor sensing applications

Oriented Crystallization on Amorphous Substrates (Microdevices)

Couches minces fonctionnelles produites par des techniques de plasma: Étude des films fonctionnels de nitrure de titane et de nitrure d'aluminium déposés sur des substrats AISI M2 et AISI D6