Woodhead Publishing Electromigration in Thin Films and Electronic Devices: Materials and Reliability (Woodhead Publishing Series in Electronic and Optical Materials)

Electromigration is a significant problem affecting the reliability of microelectronic devices such as integrated circuits. Recent research has focussed on how electromigration affects the increasing use by the microelectronics industry of lead-free solders and copper interconnects. Part one reviews ways of modelling and testing electromigration, part two discusses electromigration in copper interconnects and part three covers solder and wirebonds. Key Features: provides up-to-date coverage of the continued development of advanced copper interconnects for integrated circuits; comprehensively reviews modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation, and x-ray microbeam studies of electromigration; deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Contents: Part 1 Introduction: Modelling of electromigration phenomena; Modeling electromigration using the peridynamics approach; Modeling, simulation, and x-ray microbeam studies of electromigration. Part 2 Electromigration in copper interconnects: X-ray microbeam analysis of electromigration in copper interconnects; Voiding in copper interconnects during electromigration; The evolution of microstructure in copper interconnects during electromigration; Scaling effects on electromigration reliability of copper interconnects; Electromigration failure in nanoscale copper interconnects. Part 3 Electromigration in solder and Wirebonds: Electromigration-induced microstructural evolution in lead-free and lead-tin solders; Electromigration in flip-chip solder joints.