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Springer Mechanics of Solder Alloy Interconnects (Electrical Engineering)

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Description

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
31 January 1994
Listed Since
09 February 2007

Barcode

No barcode data available

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