£135.24

Cheaper than 32% of the days we've watched it.

£135 today · 30-day average £140 · all-time low £100

Elsevier Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture, Mechanical and ... ... Series in Electronic and Optical Materials)

View at Amazon

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 74 days · 74 data points (no recent data)

Historical
Generating forecast…
£140.00 £96.00 £105.60 £115.20 £124.80 £134.40 £144.00 11 August 2026 29 August 2026 16 September 2026 04 October 2026 23 October 2026
View at Amazon ↗

Price data last checked 17 day(s) ago - will refresh soon

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↑ Price chart
when this has been cheap or pricey
↑ Forecast
where the price is heading next
↓ Statistics
all-time high & low, recent range
↑ Price alert
name your number, we'll email you

Price Distribution

Price distribution over 74 days • 3 price levels

Days at Price
Current Price
50 days 1 day · current 23 days 0 13 25 38 50 £100 £135 £140 Days at Price

Price Analysis

Most common price: £100 (50 days, 67.6%)

Price range: £100 - £140

Price levels: 3 different prices over 74 days

Description

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study

Product Specifications

Barcode

No barcode data available

Similar Products You Might Like

Reliability of Microtechnology: Interconnects, Devices and Systems
82% match

Reliability of Microtechnology: Interconnects, Devices and Systems

Springer

£129.99 26 Oct 2026
Manufacturing Challenges in Electronic Packaging
82% match

Manufacturing Challenges in Electronic Packaging

Springer

£76.06 23 Oct 2026
Mechatronic Reliability: Electric Failures, Mechanical-Electrical Coupling, Domain Switching, Mass-Flow Instabilities
81% match

Mechatronic Reliability: Electric Failures, Mechanical-Electrical Coupling, Domain Switching, Mass-Flow Instabilities

Springer

£80.97 09 Sep 2026
Force Sensors for Microelectronic Packaging Applications (Microtechnology and MEMS)
81% match

Force Sensors for Microelectronic Packaging Applications (Microtechnology and MEMS)

Springer

£76.42 31 Oct 2026
Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications)
81% match

Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications)

Elsevier

£76.55 23 Oct 2026
Failure Modes and Mechanisms in Electronic Packages
81% match

Failure Modes and Mechanisms in Electronic Packages

Springer

£89.88 27 Oct 2026
Electronic Packaging for High Reliability, Low Cost Electronics: 57 (NATO Science Partnership Subseries: 3, 57)
81% match

Electronic Packaging for High Reliability, Low Cost Electronics: 57 (NATO Science Partnership Subseries: 3, 57)

Springer

£121.39 29 Aug 2026
Electronic Packaging for High Reliability, Low Cost Electronics: 57 (NATO Science Partnership Subseries: 3, 57)
81% match

Electronic Packaging for High Reliability, Low Cost Electronics: 57 (NATO Science Partnership Subseries: 3, 57)

Springer

£110.54 27 Oct 2026
Infrared Thermography in the Evaluation of Aerospace Composite Materials: Infrared Thermography to Composites
80% match

Infrared Thermography in the Evaluation of Aerospace Composite Materials: Infrared Thermography to Composites

Elsevier

£119.57 25 Oct 2026
Packaging of High Power Semiconductor Lasers (Micro- and Opto-Electronic Materials, Structures, and Systems)
80% match

Packaging of High Power Semiconductor Lasers (Micro- and Opto-Electronic Materials, Structures, and Systems)

Springer

£129.26 21 Oct 2026
Additive Manufacturing of Polymer Composites: Technologies, Materials, and Applications (Woodhead Publishing Series in Composites Science and Engineering)
80% match

Additive Manufacturing of Polymer Composites: Technologies, Materials, and Applications (Woodhead Publishing Series in Composites Science and Engineering)

Elsevier

£125.05 22 Oct 2026
Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development
80% match

Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development

Springer

£121.75 30 Oct 2026
Interfacial Compatibility in Microelectronics: Moving Away from the Trial and Error Approach (Microsystems)
80% match

Interfacial Compatibility in Microelectronics: Moving Away from the Trial and Error Approach (Microsystems)

Springer

£113.94 23 Oct 2026
80% match

Reliability of Gallium Arsenide MMIC′s (Paper)

Wiley

Price unavailable
Polymer Composites in the Aerospace Industry (Woodhead Publishing Series in Composites)
80% match

Polymer Composites in the Aerospace Industry (Woodhead Publishing Series in Composites)

Elsevier

£98.92 22 Oct 2026
Integrated Circuit Packaging, Assembly and Interconnections
80% match

Integrated Circuit Packaging, Assembly and Interconnections

Springer

£73.14 23 Oct 2026
Nanopackaging: Nanotechnologies and Electronics Packaging
80% match

Nanopackaging: Nanotechnologies and Electronics Packaging

Springer

£137.41 24 Oct 2026
Lead Free Solder: Mechanics and Reliability
80% match

Lead Free Solder: Mechanics and Reliability

Springer

£69.37 21 Oct 2026
Automotive-Grade Electronics: Reliability Design Theory, Development Process, and Full Lifetime Management
80% match

Automotive-Grade Electronics: Reliability Design Theory, Development Process, and Full Lifetime Management

Elsevier

£211.99 17 Oct 2026
Electronic Materials and Processes Handbook
80% match

Electronic Materials and Processes Handbook

McGraw-Hill Education

£97.95 23 Oct 2026
Robust Computing with Nano-scale Devices: Progresses and Challenges: 58 (Lecture Notes in Electrical Engineering, 58)
80% match

Robust Computing with Nano-scale Devices: Progresses and Challenges: 58 (Lecture Notes in Electrical Engineering, 58)

Springer

£74.27 22 Oct 2026
Fundamentals of Bias Temperature Instability in MOS Transistors: Characterization Methods, Process and Materials Impact, DC and AC Modeling: 52 (Springer Series in Advanced Microelectronics, 52)
80% match

Fundamentals of Bias Temperature Instability in MOS Transistors: Characterization Methods, Process and Materials Impact, DC and AC Modeling: 52 (Springer Series in Advanced Microelectronics, 52)

Springer

£78.84 22 Oct 2026
Dielectric Films for Advanced Microelectronics (Wiley Series in Materials for Electronic & Optoelectronic Applications)
80% match

Dielectric Films for Advanced Microelectronics (Wiley Series in Materials for Electronic & Optoelectronic Applications)

Wiley

£197.99 30 Oct 2026
Silicon Carbide Microsystems for Harsh Environments: 22 (MEMS Reference Shelf, 22)
80% match

Silicon Carbide Microsystems for Harsh Environments: 22 (MEMS Reference Shelf, 22)

Springer

£115.55 21 Oct 2026