Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications) - Image 1

£74.54

William Andrew Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications)

Name: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications)
Brand: William Andrew
Price: 109.73 GBP
Availability: InStock

Chemistry

Price History & Forecast

Last 90 days • 90 data points

Historical

Generating forecast...

Price Distribution

Price distribution over 90 days • 2 price levels

Days at Price

Current Price

Price Analysis

Most common price: £110 (85 days, 94.4%)

Price range: £75 - £110

Price levels: 2 different prices over 90 days

Description

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.

Product Specifications

Brand: William Andrew
Format: hardcover
ASIN: 0815515138
Category: Books > Subjects > Science, Nature & Maths > Chemistry
Domain: Amazon UK
Release Date: 15 July 2005
Listed Since: 05 February 2007

Barcode

No barcode data available

William Andrew Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications)

Price History & Forecast

Price Distribution

Price Analysis

Description

Product Specifications

Barcode

Similar Products You Might Like

Adhesive Bonding: Science, Technology and Applications (Series in Welding and Other Joining Technologies) (Woodhead Publishing Series in Welding and Other Joining Technologies)

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture, Mechanical and ... ... Series in Electronic and Optical Materials)

Microwave/RF Applicators and Probes: for Material Heating, Sensing, and Plasma Generation

Nanoimprint Technology: Nanotransfer for Thermoplastic and Photocurable Polymers (The Wiley Microsystem and Nanotechnology Series)

Advanced Noncontact Cutting and Joining Technologies: Micro- and Nano-manufacturing (Mechanical Engineering Series)

Advanced Noncontact Cutting and Joining Technologies: Micro- and Nano-manufacturing (Mechanical Engineering Series)

Dielectric Materials for Electrical Engineering

Technical Textiles and Smart Textiles: Materials, Technologies and Applications

Graphene Technology: From Laboratory to Fabrication

Advances in Nonvolatile Memory and Storage Technology (Woodhead Publishing Series in Electronic and Optical Materials)

Advanced Interconnects for ULSI Technology

Self-Healing Polymers and Polymer Composites

Transparent Ceramics: Materials, Engineering, and Applications

Ceramic Coatings CESP V27 Is3: 39 (Ceramic Engineering and Science Proceedings)

Additive Manufacturing of Polymer Composites: Technologies, Materials, and Applications (Woodhead Publishing Series in Composites Science and Engineering)

Handbook of Sustainable Polymers for Additive Manufacturing

Advanced Nanostructured Thin Films for Biomedical Applications (Vacuum and Thin-Film Deposition Technologies)

Synthesized Transmission Lines: Design, Circuit Implementation, and Phased Array Applications (IEEE Press)

Thin Films and Coatings: Engineering Applications (Engineering Materials)

Electronics Cooling: From the Chip to the Datacenter (Volume 62) (Advances in Heat Transfer, Volume 62)

Microwaves, Millimeter Wave and Terahertz Liquid Crystals: Preparation, Characterization and Applications (Modern Antenna)

Design, Development, and Applications of Engineering Ceramics and Composites: A Collection of Papers Presented at the 8th Pacific Rim Conference on ... Columbia: 215 (Ceramic Transactions Series)

Clay-Containing Polymer Nanocomposites: From Fundamentals to Real Applications

Nanocomposites: Preparation, Characterization and Modeling