Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications) - Image 1

£74.54

William Andrew Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications)

Name: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications)
Brand: William Andrew
Price: 74.54 GBP
Availability: InStock

Chemistry

It has never been this cheap. We have no record of a lower price.

£75 today · cheaper than every other day in the last 3 months

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↓ Price chart
when this has been cheap or pricey

↓ Forecast
where the price is heading next

↓ Statistics
all-time high & low, recent range

↑ Price alert
name your number, we'll email you

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 59 days • 59 data points (No recent data available)

Historical

Generating forecast...

Price Distribution

Price distribution over 59 days • 2 price levels

Days at Price

Current Price

Price Analysis

Most common price: £110 (40 days, 67.8%)

Price range: £75 - £110

Price levels: 2 different prices over 59 days

Description

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.

Product Specifications

Brand: William Andrew
Format: hardcover
ASIN: 0815515138
Category: Books > Subjects > Science, Nature & Maths > Chemistry
Domain: Amazon UK
Release Date: 15 July 2005
Listed Since: 05 February 2007

Barcode

No barcode data available

William Andrew Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications)

It has never been this cheap. We have no record of a lower price.

Price History & Forecast

Price Distribution

Price Analysis

Description

Product Specifications

Barcode

Similar Products You Might Like

Electronics Reliability and Measurement Technology: Nondestructive Evaluation

Handbook of Polymer Coatings for Electronics: Chemistry, Technology and Applications Second Edition

Adhesive Bonding: Science, Technology and Applications (Series in Welding and Other Joining Technologies) (Woodhead Publishing Series in Welding and Other Joining Technologies)

Handbook of Contamination Control in Microelectronics: Principles, Applications and Technology

Reliability of Microtechnology: Interconnects, Devices and Systems

Dielectric Films for Advanced Microelectronics (Wiley Series in Materials for Electronic & Optoelectronic Applications)

Semiconductor Materials and Process Technology Handbook

Fügetechnologie Kleben: eine Anleitung für den zeitgemässen und sicheren Klebprozess in Industrie und Handwerk

Bonding in Microsystem Technology: 24 (Springer Series in Advanced Microelectronics, 24)

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture, Mechanical and ... ... Series in Electronic and Optical Materials)

Electronics Reliability and Measurement Technology: Nondestructive Evaluation

Adhesive Bonding

Adhesion Science and Technology

Microwave/RF Applicators and Probes: for Material Heating, Sensing, and Plasma Generation

Fatigue and Tribological Properties of Plastics and Elastomers (Plastics Design Library)

Nanopackaging: Nanotechnologies and Electronics Packaging

Handbook of Plastic Foams: Materials, Processing and Applications (Plastics Design Library)

The Effect of Creep and Other Time Related Factors on Plastics and Elastomers: Second Edition

Ultra-thin Chip Technology and Applications

Handbook of Refractory Carbides & Nitrides: Properties, Characteristics, Processing and Applications

Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using ... (Springer Series in Advanced Manufacturing)

Nanoimprint Technology: Nanotransfer for Thermoplastic and Photocurable Polymers (The Wiley Microsystem and Nanotechnology Series)

Reactive Polymers Fundamentals and Applications: A Concise Guide to Industrial Polymers (Plastics Design Library)

Nanobiomaterials in Hard Tissue Engineering: Applications of Nanobiomaterials