Springer Silicon Nanowire Transistors

Product Description This book describes the n and p-channel Silicon Nanowire Transistor (SNT) designs with single and dual-work functions, emphasizing low static and dynamic power consumption.  The authors describe a process flow for fabrication and generate SPICE models for building various digital and analog circuits.  These include an SRAM, a baseband spread spectrum transmitter, a neuron cell and a Field Programmable Gate Array (FPGA) platform in the digital domain, as well as high bandwidth single-stage and operational amplifiers, RF communication circuits in the analog domain, in order to show this technology’s true potential for the next generation VLSI.   From the Back Cover This book describes the n and p-channel Silicon Nanowire Transistor (SNT) designs with single and dual-work functions, emphasizing low static and dynamic power consumption.  The authors describe a process flow for fabrication and generate SPICE models for building various digital and analog circuits.  These include an SRAM, a baseband spread spectrum transmitter, a neuron cell and a Field Programmable Gate Array (FPGA) platform in the digital domain, as well as high bandwidth single-stage and operational amplifiers, RF communication circuits in the analog domain, in order to show this technology’s true potential for the next generation VLSI.     Describes Silicon Nanowire (SNW) Transistors, as vertically constructed MOS n and p-channel transistors, with low static and dynamic power consumption and small layout footprint;  Targets System-on-Chip (SoC) design, supporting very high transistor count (ULSI), minimal power consumption requiring inexpensive substrates for packaging;  Enables fabrication of different types of memory on the same chip, such as capacitive cells and transistors with floating gates that can be used as DRAMs and Flash memories. About the Author Ahmet Bindal received his M.S. and Ph.D. degrees in Electrical Engineering Department from the University of California, Los Angeles CA. His doctoral research was the material characterization and analysis of HEMT GaAs transistors. During his graduate studies, he was a research associate and technical consultant for Hughes Aircraft Co. In 1988, he joined the technical staff of IBM Research and Development Center in Fishkill, NY, where he worked as a device design and characterization engineer. He developed asymmetrical MOS transistors and ultra thin Silicon-On-Insulator (SOI) technologies for IBM. In 1993, he transferred to IBM in Rochester, MN, as a senior circuit design engineer to work on the floating-point unit for AS-400 main frame processor. He continued his circuit design career at Intel Corporation in Santa Clara, CA, where he designed 16-bit packed multipliers and adders for the MMX unit for Pentium II processors. In 1996, he joined Philips Semiconductors in Sunnyvale, CA, where he was involved in the designs of instruction and data caches, and various SRAM modules for the Trimedia processor. His involvement with VLSI architecture also started in Philips Semiconductors and led to the design of the Video-Out unit for the same processor. In 1998, he joined Cadence Design Systems as a VLSI architect and directed a team of engineers to design self-timed asynchronous processors. After approximately 20 years of industry work, he joined the Computer Engineering faculty at San Jose State University in 2002. His current research interests range from nano-scale electron devices to nano-scale architectures and robotics. Dr. Bindal has over 30 refereed scientific publications and 10 invention disclosures with IBM. He currently holds three U.S. patents with IBM and one with Intel Corporation. Dr. Hamedi-Hagh received his Ph.D. from the University of Toronto, Canada in 2004. He joined the Electrical Engineering Department at San Jose State University (SJSU) in 2005. His areas of research and expertise include high frequency modeling of semiconductor