Reliability, Packaging, Testing, and Characterization of Mems/moems VI (Proceedings of SPIE)

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII: 7 (Proceedings of SPIE)

Reliability, Packaging, Testing, and Characterization of Mems/moems and Nanodevices IX

International Conference on Optical Instruments and Technology 2008: Mems/ Nems Technology and Applications (Proceedings of Spie)

MOEMS Display, Imaging, and Miniaturized Microsystems IV (Proceedings of SPIE)

Bio-Mems and Medical Microdevices (Proceedings of SPIE): No. 8765

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII (Proceedings of SPIE): v. 7206

MEMS/MOEMS Components and Their Applications V. Special Focus Topics: Transducers at the Micro-Nano Interface: 5 (Proceedings of SPIE)

Organic Field-Effect Transistors XII; and Organic Semiconductors in Sensors and Bioelectronics VI (Proceedings of SPIE)

Advanced Signal Processing Algorithms, Architectures and Implementations: Pt. XVI (Proceedings of SPIE)

Ultrafast Phenomena in Semiconductors and Nanostructure Materials XI and Semiconductor Photodetectors IV (Proceedings of SPIE)

Advanced Materials and Devices for Sensing and Imaging III: 3 (Proceedings of SPIE)

Applications of Emerging Memory Technology: Beyond Storage: 63 (Springer Series in Advanced Microelectronics, 63)

Springer

VLSI Circuits and Systems IV (Proceedings of SPIE): v. 7363

MEMS/MOEMS Technologies and Applications III: 3 (Proceedings of SPIE)

Smart Biomedical and Physiological Sensor Technology VI (Proceedings of SPIE): v. 7313

Smart Materials V (Proceedings of SPIE): v. 7267

Micro (MEMS) and Nanotechnologies for Space, Defense, and Security II (Proceedings of SPIE)

Mems Adaptive Optics (Proceedings of SPIE)

MEMS Computer Vision and Robotic Manipulation System

GRIN Verlag

Advanced Signal Processing Algorithms, Architectures, and Implementations XV (Proceedings of SPIE)

MEMS, MOEMS, and Micromachining III (Proceedings of SPIE)

Photonics Packaging, Integration, and Interconnects VIII: 8 (Proceedings of SPIE)

Chemical and Biological Sensors for Industrial and Environmental Monitoring III (Proceedings of SPIE)

Independent Component Analyses, Wavelets, Unsupervised Nano-biomimetic Sensors, and Neural Networks VI: 6 (Proceedings of SPIE)