£150.00

William Andrew - Tribology of Abrasive Machining Processes

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Description

Explore the evolving landscape of manufacturing with Tribology of Abrasive Machining Processes by William Andrew. As machining technologies advance from high wheel speeds to nanotechnology, understanding the underlying tribological elements becomes essential for driving efficiency and maintaining high product quality. This book provides a fundamental rethinking of how tribology affects abrasive machining. It is designed to help researchers, students, engineers, and technicians navigate modern manufacturing challenges. By treating newer processes like chemical mechanical polishing (CMP) and silicon wafer dicing as tribological processes, this text offers a clearer perspective on how these methods function. Whether you are studying advanced material removal or working in industrial manufacturing, this resource provides the technical foundation needed to understand process efficiency. It bridges the gap between traditional machining concepts and modern, high-tech advancements in the field.

Key Features

Provides a fundamental rethinking of tribological elements in abrasive machining to improve process efficiency and product quality.

Covers a wide range of modern advancements including high wheel speeds and nanotechnology applications.

Explains newer manufacturing methods such as chemical mechanical polishing (CMP) through a tribological lens.

Offers technical insights into silicon wafer dicing for researchers and engineers in the semiconductor field.

Serves as a comprehensive resource for students and technicians working in manufacturing and chemistry.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
30 May 2004
Listed Since
30 December 2006

Barcode

No barcode data available

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