William Andrew Advances in Cmp Polishing Technologies

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology – the science of friction, wear and lubrication – the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan Review In a field where commercial confidentiality has limited the spread of knowledge, this book opens up emerging technologies and new applications to a wide audience of engineers in the semiconductor industry and beyond About the Author Ioan D. Marinescu is Professor and Director of the Precision Micromachining Center at The University of Toledo, Ohio, USA, and CEO of Advanced Manufacturing Solutions, LLC. His research interests include manufacturing processes, grinding, tribology, advanced materials, and machining of brittle materials.