We can't find the internet
Attempting to reconnect
Something went wrong!
Hang in there while we get back on track
This item is currently unavailable
DEStech Publications, Inc Heat Sealing Technology and Engineering - DEStech Publications
Price data last checked 68 day(s) ago - refreshing...
Price History & Forecast
Last 23 days • 23 data points (No recent data available)
Price Distribution
Price distribution over 23 days • 1 price levels
Price Analysis
Most common price: £122 (23 days, 100.0%)
Price range: £122 - £122
Price levels: 1 different prices over 23 days
Description
Key Features
Comprehensive coverage of all heat sealing phases specifically related to the packaging industry.
Detailed explanations of thermoplastic materials and basic heat-sealing processes for foundational knowledge.
Includes numerous formulas and original experimental data to assist with technical calculations.
Provides new methods to improve heat sealing reliability and enhance packaging quality.
Introduces novel monitoring techniques to help engineers control parameters for safer seals.
Applicable to various packaging formats including pouches, bags, and cups across different materials.
Product Specifications
- Format
- paperback
- ASIN
- 1932078851
- Domain
- Amazon UK
- Release Date
- 30 June 2009
- Listed Since
- 27 February 2009
Barcode
No barcode data available
Similar Products You Might Like
Thermal Management of Microelectronic Equipment (Electronic Packaging): Heat Transfer Theory, Analysis Methods, and Design Practices
ASME Press
Encyclopedia Of Thermal Packaging, Set 3: Thermal Packaging Applications (A 3-Volume Set)
Scientific Publishing
Packaging Technology and Engineering: Pharmaceutical, Medical and Food Applications
Wiley
Protective Packaging for Distribution: Design and Development
DEStech Publications, Inc
High Temperature Electronics (Electronic Packaging)
CRC Press
Advanced Thermal Design of Electronic Equipment
Springer
Bioactive Food Packaging
DEStech Publications, Inc
Packaging for Nonthermal Processing of Food (Institute of Food Technologists Series)
Wiley
Thermal Stress and Strain in Microelectronics Packaging
Springer
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)
Woodhead Publishing
The Electronic Packaging Handbook (Electronics Handbook Series)
CRC Press
Development of Packaging and Products for Use in Microwave Ovens (Woodhead Publishing in Materials)
Woodhead Publishing
Thermal Processing of Packaged Foods (Food Engineering Series)
Springer
Industrial Heating: Principles, Techniques, Materials, Applications, and Design (Dekker Mechanical Engineering)
CRC Press
A Guide to Modeling Thermoplastic Composite Manufacturing Processes: Optimizing Process Variables and Tooling Design Using Finite Element Analysis
DEStech Publications, Inc
Thermal Management of Telecommunications Equipment (ASME Press Book Series on Electronic Packaging)
ASME Press
Semiconductor Advanced Packaging
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
Wiley
Advanced Materials for Thermal Management of Electronic Packaging: 30 (Springer Series in Advanced Microelectronics, 30)
Springer
Engineering Aspects of Thermal Food Processing (Contemporary Food Engineering)
CRC Press
Thermal Food Processing: New Technologies and Quality Issues, Second Edition (Contemporary Food Engineering)
CRC Press
Wiley Quality Conformance of Microelectronic Packages Book
Wiley
Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
CRC Press
Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
CRC Press