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CRC Press Noise Coupling in System-on-Chip Technical Book

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Description

Noise coupling is a primary cause of failures in System on Chip (SoC) products. This technical book from CRC Press addresses the needs of the design community by introducing a breakthrough substrate coupling analysis flow and modeling toolset. Readers can learn to analyze noise components as they propagate through the substrate, parasitic interconnects, and the package. This resource helps engineers analyze and avoid complex noise coupling that degrades performance in RF and mixed signal designs. By implementing these methods, designers can reduce the need for conservative design practices. The content features chapters written by leading international experts in the field of electronics and communications engineering.

Key Features

This CRC Press book provides a breakthrough substrate coupling analysis flow and modeling toolset for SoC design.

Learn to analyze noise components propagating through the substrate, parasitic interconnects, and the package.

Avoid complex noise coupling that degrades the performance of RF and mixed signal designs.

Reduce the reliance on conservative design practices by using advanced analysis methods.

Access technical insights from chapters written by leading international experts in the industry.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
27 December 2017
Listed Since
11 July 2017

Barcode

No barcode data available

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